Methods for flattening a 3D surface into a 2D piece
AssigneeThe Chinese University of Hong Kong
InventorChangling Charlie Wang
Life of this patent
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Abstract
Disclosed is a method for flattening a 3D surface into a 2D piece. In one embodiment, the method is implemented by constructing a plurality of wire-patches by feature curves on a surface patch of the 3D surface, wherein each of feature curves comprises a plurality of wire-nodes; computing an optimal 2D angle for each of said wire-nodes of the constructed wire-patches; determining an optimal position for each of said wire-nodes based on the computed optimal 2D angles thereof, respectively; and laying out each of said feature curves in 2D based on the determined optimal position. A device to flatten a 3D surface into a 2D piece is also provided.
Claims16
A method for flattening a 3D surface into a 2D piece, comprising:
- constructing, by a constructing unit integrated into a chip, a plurality of wire-patches by feature curves on a surface patch of the 3D surface, wherein each of feature curves comprises a plurality of wire-nodes;
- computing an optimal 2D angle for each of said wire-nodes of the constructed wire-patches;
- determining an optimal position for each of said wire-nodes based on the computed optimal 2D angles thereof, respectively;
- and
- laying out each of said feature curves in 2D based on the determined optimal position, wherein the optimal 2D angle for each of said wire-nodes is computed based on a constraint that edges on a boundary of the wire-patches in which said wire-nodes are located are simulated as tendon wires with length preserved, and surface-angle variations between the edges and the tendon wires are minimized.
A device for flattening a 3D surface into a 2D piece, comprising:
- a constructing unit integrated into a chip and configured to construct a plurality of wire-patches in a 3D surface and order the constructed wire-patches as a queue, the queue defining a warping order for the plurality of wire-patches;
- a warping unit configured to warp each of the plurality of wire-patches according to the warping order so as to determine an optimal position in 2D for each of said wire-nodes;
- and
- a laying unit configured to lay out each of feature curves in 2D based on the determined optimal position for each of the wire-nodes,
- wherein the warping unit is configured to warp each of said wire-nodes based on a constraint that edges on a boundary of the wire-patches in which said wire-nodes are located are simulated as tendon wires with length preserved, and surface-angle variations between the edges and the tendon wires are minimized.
Dependencies are inferred from the claim text.