Vertical quasi-CPWG transmission lines

Multiple-component circuitry comprising:

• a printed circuit board (PCB);
• a first set of CPWG transmission lines disposed on the PCB in a first plane;
• a vertical transition component mounted on the PCB, the vertical transition component having electrically conductive vias extending through at least a portion of the vertical transition component, the vias being configured to transition signals between the first set of CPWG transmission lines and a second set of CPWG transmission lines arranged in a second plane separate from the first plane, the vias including a signal via, a side-ground via positioned a first distance from the signal via in a first direction, and a rear-ground via positioned a second distance from the signal via in a second direction that is substantially perpendicular to the first direction;
• a ground plane disposed within the vertical transition component and electrically coupled to the side-ground via and the rear-ground via, the ground plane having one or more openings through which the signal via passes;
• and
• an integrated circuit mounted on the vertical transition component so as to be in electrical contact with the second set of coplanar waveguide transmission lines.

A coplanar waveguide (CPWG) signal transition component configured to transition high-speed signals between a first set of CPWG transmission lines positioned in a first x-z plane on a top surface of the CPWG signal transition component and a second set of CPWG transmission lines positioned in a second x-z plane, the CPWG transition component comprising:

• a dielectric layer;
• one or more signal vias extending through the dielectric layer;
• a ground plane disposed within the dielectric layer through which the one or more signal vias pass;
• and
• three or more ground vias extending through at least a portion of the dielectric layer from the ground plane to the second set of CPWG transmission lines, there being at least two more of the ground vias than of the one or more signal vias, at least two of the ground vias being side-ground vias and being aligned in a first y-z plane, at least one of the one or more signal vias also being aligned in the first y-z plane, and at least one of the ground vias being a rear-ground via and being positioned in a second y-z plane separate from the first y-z plane.