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US 8,410,868 B2Granted
Methods and apparatus for temperature control of devices and mechanical resonating structures
AssigneeSand 9, Inc.
InventorsKlaus Juergen Schoepf, Reimund Rebel
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Abstract
Methods and apparatus for temperature control of devices and mechanical resonating structures are described. A mechanical resonating structure may include a heating element and a temperature sensor. The temperature sensor may sense the temperature of the mechanical resonating structure, and the heating element may be adjusted to provide a desired level of heating. Optionally, additional heating elements and/or temperature sensors may be included.
Claims24
A device, comprising:
- a mechanical resonating structure including
- a heating element configured to control a temperature of the mechanical resonating structure, and
- a temperature sensor configured to detect the temperature of the mechanical resonating structure,
- wherein the mechanical resonating structure is formed at least partially of a piezoelectric material,
- wherein the heating element comprises a region of doped material, and
- wherein the doped material comprises a doped piezoelectric material.
3 more elements
A device, comprising:
- a mechanical resonating structure including
- a heating element configured to control a temperature of the mechanical resonating structure, and
- a temperature sensor configured to detect the temperature of the mechanical resonating structure,
- wherein the mechanical resonating structure is formed at least partially of a piezoelectric material,
- wherein the temperature sensor comprises a region of doped material, and
- wherein the doped material comprises a doped piezoelectric material.
3 more elements
A device, comprising:
- a mechanical resonating structure including
- a heating element configured to control a temperature of the mechanical resonating structure, and
- a temperature sensor configured to detect the temperature of the mechanical resonating structure,
- wherein the mechanical resonating structure is formed at least partially of a piezoelectric material, and
- wherein the mechanical resonating structure is coupled to a substrate having a front surface and a back surface, and wherein the heating element is a first heating element, and wherein the device further comprises a second heating element formed on the back surface of the substrate.
2 more elements
A device, comprising:
- a mechanical resonating structure including
- a heating element configured to control a temperature of the mechanical resonating structure, and
- a temperature sensor configured to detect the temperature of the mechanical resonating structure,
- wherein the mechanical resonating formed least partially of a piezoelectric material,
- wherein the device further comprises a substrate to which the mechanical resonating structure is coupled, and further comprises a cap wafer bonded to the substrate, and
- wherein the heating element is a first heating element, and wherein the device further comprises a second heating element formed on a back side of the cap wafer.
3 more elements
A device, comprising:
- a substrate having a front surface and a back surface;
- a mechanical resonating structure formed on the front surface of the substrate;
- and
- a heating element formed on or within the substrate,
- wherein the mechanical resonating, structure has a largest dimension of less than approximately 100 microns, and
- wherein the substrate is a first substrate and the heating element is a first heating element, and wherein the apparatus further comprises a second substrate having a front surface and a back surface, the front surface of the second substrate being bonded to the front surface of the first substrate, and wherein the apparatus further comprises a second heating element formed on the back surface of the second substrate.
3 more elements
Dependencies are inferred from the claim text.