Inductive circuit arrangement
AssigneeNXP B.V.
InventorIgor Blednov
Life of this patent
Estimating the term…
Loading patent…
AssigneeNXP B.V.
InventorIgor Blednov
Estimating the term…
A bond wire circuit includes at least three bond wires arranged to split an input signal into two output signals. In connection with various example embodiments, bond wires are arranged in a generally parallel manner to mitigate magnetic coupling and related issues for splitting an input signal and providing each of split signals to an amplifier. The bond wires are connected by capacitive circuits that facilitate the splitting, and in some applications, additional capacitive (to ground/reference) and load circuits to further facilitate the splitting of the input signals for specific amplifier circuit implementations, and applications to various loads. In some implementations, the input signals are split in equal or arbitrary portions with frequency independent phase differences in a wide frequency band, with isolation between ports of the circuit.
An inductive circuit for splitting an input signal into two output signals, the circuit comprising:
A radio frequency amplifier circuit comprising:
A method for splitting an input signal into two output signals, the method comprising:
An inductive circuit for splitting an input signal into two output signals, the circuit comprising:
Dependencies are inferred from the claim text.