Anisotropic conductive connector, probe member and wafer inspection system

An anisotropic conductive connector comprising:

• a frame plate in which a plurality of anisotropic conductive film placement holes each extending in a thicknesswise direction thereof are formed, and a plurality of elastic anisotropic conductive films respectively disposed in the anisotropic conductive film placement holes in the frame plate and supported by peripheral part of the frame plate around the corresponding anisotropic conductive film placement hole, wherein each of the elastic anisotropic conductive films includes a plurality of connection conductive parts each extending in a thicknesswise direction of the elastic anisotropic conductive film, being disposed corresponding to a connection target electrode, and comprising an elastic polymer substance and magnetic conductive particles densely contained in the elastic polymer substance;
• and
• an insulating part that insulates the connection conductive parts from one another, and
• the elastic polymer substance forming the connection conductive parts of the elastic anisotropic conductive films disposed in a peripheral area of the frame plate have a durometer hardness higher than that of the elastic polymer substance forming the connection conductive parts of the elastic anisotropic conductive films disposed in a center area of the frame plate.

An anisotropic conductive connector comprising:

• a frame plate in which a plurality of anisotropic conductive film placement holes each extending in a thicknesswise direction thereof are formed, and a plurality of elastic anisotropic conductive films respectively disposed in the anisotropic conductive film placement holes in the frame plate and supported by peripheral part of the frame plate around the corresponding anisotropic conductive film placement hole, wherein each of the elastic anisotropic conductive films includes a plurality of connection conductive parts each extending in a thicknesswise direction of the elastic anisotropic conductive film, being disposed corresponding to a connection target electrode, and comprising an elastic polymer substance and magnetic conductive particles densely contained in the elastic polymer substance;
• and
• an insulating part that insulates the connection conductive parts from one another, and
• the connection conductive parts of the elastic anisotropic conductive films disposed in a peripheral area of the frame plate have a content of the conductive particles higher than that of the connection conductive parts of the elastic anisotropic conductive films disposed in a center area of the frame plate.

An anisotropic conductive connector comprising:

• a frame plate in which a plurality of anisotropic conductive film placement holes each extending in a thicknesswise direction thereof are formed, and a plurality of elastic anisotropic conductive films respectively disposed in the anisotropic conductive film placement holes in the frame plate and supported by peripheral part of the frame plate around the corresponding anisotropic conductive film placement hole, wherein each of the elastic anisotropic conductive films includes a plurality of connection conductive parts each extending in a thicknesswise direction of the elastic anisotropic conductive film, being disposed corresponding to a connection target electrode, and comprising an elastic polymer substance and magnetic conductive particles densely contained in the elastic polymer substance;
• and
• an insulating part that insulates the connection conductive parts from one another, and
• the connection conductive parts of the elastic anisotropic conductive films disposed in a peripheral area of the frame plate have a horizontal cross-sectional area larger than that of the connection conductive parts of the elastic anisotropic conductive films disposed in a center area of the frame plate.

An anisotropic conductive connector that is used to conduct an electrical inspection of each of a plurality of integrated circuits formed on a wafer in a state of the wafer, comprising:

• a frame plate in which a plurality of anisotropic conductive film placement holes each extending in a thicknesswise direction thereof are formed, and a plurality of elastic anisotropic conductive films respectively disposed in the anisotropic conductive film placement holes in the frame plate and supported by peripheral part of the frame plate around the corresponding anisotropic conductive film placement hole, wherein each of the elastic anisotropic conductive films includes a plurality of connection conductive parts each extending in a thicknesswise direction of the elastic anisotropic conductive film, being disposed corresponding to a connection target electrode, and comprising an elastic polymer substance and magnetic conductive particles densely contained in the elastic polymer substance;
• and
• an insulating part that insulates the connection conductive parts from one another, and at least the elastic anisotropic conductive films disposed in a peripheral area of the frame plate further include, in addition to the connection conductive parts, a non-connection conductive part extending in the thicknesswise direction of the elastic anisotropic conductive film and contain magnetic conductive particles densely in an elastic polymer substance;
• and
• when the total number of the non-connection conductive parts of the elastic anisotropic conductive films that are disposed in a center area of the frame plate and are to be connected to one of the integrated circuits on the wafer is referred to as A, and the total number of the non-connection conductive parts of the elastic anisotropic conductive films that are disposed in the peripheral area of the frame plate and are to be connected to one of the integrated circuits on the wafer is referred to as B, the relationship B>A being satisfied.