Test system and probe apparatus

A test system for testing a plurality of semiconductor chips formed on a single semiconductor wafer, comprising:

• a plurality of test modules for testing the semiconductor chips respectively;
• and
• a probe apparatus electrically connecting each of the test modules to a corresponding one of the semiconductor chips, wherein
• the probe apparatus including:
• a wire substrate provided with a plurality of terminals;
• a wafer tray forming a hermetically sealed space with the wire substrate, and for mounting the semiconductor wafer on a surface of the wafer tray nearer the hermetically sealed space;
• a probe wafer provided between the wire substrate and the wafer tray, where apparatus connection terminals provided on a surface of the probe wafer nearer the wire substrate are electrically connected to terminals of the wire substrate, and where a plurality of wafer connection terminals provided on a surface of the probe wafer nearer the wafer tray are electrically connected to the plurality of semiconductor chips respectively in a collective manner;
• an apparatus anisotropic conductive sheet provided between the wire substrate and the probe wafer and, by being pressed, electrically connecting the terminals of the wire substrate to the apparatus connection terminals;
• a wafer anisotropic conductive sheet provided between the probe wafer and the semiconductor wafer and, by being pressed, electrically connecting each terminal of the semiconductor wafer to each of the plurality of wafer connection terminals;
• and
• a decompressing section that decompresses the hermetically sealed space between the wire substrate and the wafer tray, so as to cause the wafer tray to move to a predetermined position from the wire substrate, to electrically connect the wire substrate and the probe wafer, and to electrically connect the probe wafer and the semiconductor wafer.