Electric field detection probe, method thereof, and manufacturing method of circuit board
AssigneeFujitsu Limited
InventorsDaisuke Uchida, Shinichi Wakana
Life of this patent
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Abstract
An electric field detection probe includes a cable including an internal conductor line, an insulating layer that coats a surface of the internal conductor line and exposes a tip end of the internal conductor line, an external conductor layer that coats a surface of the insulating layer and exposes the tip end, and an electric field diaphragm wherein the electric field diaphragm is electrically coupled to the external conductor layer, covers the tip end surface of the cable except for an opening.
Claims20
An electric field detection probe, comprising:
- a cable including,
- an internal conductor line;
- an insulating layer that coats a surface of the internal conductor line and exposes a tip end of the internal conductor line;
- an external conductor layer that coats a surface of the insulating layer and exposes the tip end;
- and
- an electric field diaphragm,
- wherein the electric field diaphragm is electrically coupled to the external conductor layer, covers the tip end surface of the cable except for an opening,
- wherein the electric field diaphragm includes the opening that is formed in a position to face the tip end of the internal conductor line, and the diameter of the opening is smaller than the diameter of the internal conductor line.
A method for detecting an electric field, comprising:
- moving an opening of an electric field detection probe closer to a wiring to be detected;
- and
- detecting an electric field near the wiring by the electric filed detection probe;
- whereby, the electric field detection probe includes,
- a cable that includes, an internal conductor line;
- an insulating layer that coats a surface of the internal conductor line and exposes a tip end of the internal conductor line;
- an external conductor layer that coats a surface of the insulating layer and exposes the tip end;
- and
- an electric field diaphragm,
- wherein the electric field diaphragm is electrically coupled to the external conductor layer and covers the tip end surface of the cable except for the opening,
- wherein the electric field diaphragm includes the opening that is formed in a position to face the tip end of the internal conductor line, and the diameter of the opening is smaller than the diameter of the internal conductor line.
A method for manufacturing a circuit board, comprising:
- forming a wiring over a substrate to form a circuit board;
- detecting an electric field near the wiring using an electric field detection probe by positioning an opening of the electric field detection probe closer to the wiring to be detected;
- and
- evaluating the circuit board based on the electric field;
- whereby the electric field detection probe includes:
- a cable that further includes, an internal conductor line;
- an insulating layer that coats a surface of the internal conductor line and exposes a tip end of the internal conductor line;
- an external conductor layer that coats a surface of the insulating layer and exposes the tip end;
- and
- an electric field diaphragm, wherein the electric field diaphragm is electrically coupled to the external conductor layer, and covers the tip end surface of the cable except for the opening,
- wherein the electric field diaphragm includes the opening that is formed in a position to face the tip end of the internal conductor line, and the diameter of the opening is smaller than the diameter of the internal conductor line.
Dependencies are inferred from the claim text.