Granular epoxy resin composition for encapsulating semiconductor, semiconductor device using the same and method for producing semiconductor device
AssigneeSumitomo Bakelite Co., Ltd.
InventorsYasuhiro Mizuno, Kazuya Shigeno
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Abstract
Disclosed is a granular epoxy resin composition for encapsulating a semiconductor used for a semiconductor device obtained by encapsulating a semiconductor element by compression molding, wherein, in the particle size distribution as determined by sieving the whole epoxy resin composition for encapsulating a semiconductor using JIS standard sieves, the ratio of particles having a size of 2 mm or greater is not more than 3% by mass, the ratio of particles having a size of 1 mm or greater, but less than 2 mm is from 0.5% by mass or more to 60% by mass or less, and the ratio of microfine particles having a size of less than 106 μm is not more than 5% by mass.
Claims9
A granular epoxy resin composition for encapsulating a semiconductor element used for a semiconductor device obtained by encapsulating the semiconductor element by compression molding,
- wherein, in a particle size distribution of said granular epoxy resin composition as determined by sieving said granular epoxy resin composition for encapsulating the semiconductor element using JIS standard sieves,
- a ratio of particles to said granular epoxy resin composition total having a size of 2 mm or greater is not more than 3% by mass,
- a ratio of particles to said granular epoxy resin composition total having a size of 1 mm or greater, but less than 2 mm is from 0.5% or more by mass to 60% or less by mass, and
- a ratio of microfine particles to said granular epoxy resin composition total having a size of less than 106 μm is not more than 5% by mass.
A granular epoxy resin composition for encapsulating the semiconductor element used for a semiconductor device obtained by encapsulating the semiconductor element by compression molding,
- wherein, in the particle size of said granular epoxy resin composition distribution as determined by sieving said granular epoxy resin composition for encapsulating the semiconductor element using JIS standard sieves,
- a ratio of coarse particles having a size of 2 mm or greater is not more than 3% by mass, a ratio of micro fine particles having a size of less than 106 ↑m is not more than 5% by mass, and
- a ratio (D1/D2) of a granule density D1 of said epoxy resin composition for encapsulating the semiconductor to the specific gravity D2 of a cured product after curing said epoxy resin composition for encapsulating the semiconductor element is in the range of 0.88 or more to 0.97 or less.
Dependencies are inferred from the claim text.