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US 8,410,603 B2Granted
Semiconductor device and package
AssigneeSK hynix Inc.
InventorJin Ho Bae
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a semiconductor substrate having an upper surface, a lower surface, a first side and a second side, wherein the lower surface has a slope so that the first side is thicker than the second side, and a circuit pattern including a bonding pad on the upper surface of the semiconductor substrate.
Claims13
A semiconductor package comprising:
- a first and a second semiconductor chips, each having an upper surface, a lower surface, a first side, a second side and a bonding pad formed on an edge portion of the upper surface, wherein the lower surface has a slope so that the first side is thicker than the second side;
- a spacer formed between the first and the second semiconductor chips, wherein the first side of the first semiconductor chip is arranged over the second side of the second semiconductor chip;
- and
- a substrate, on which the first and the second semiconductor chips and the spacer are mounted, electrically connected to the first and the second semiconductor chips.
1 more element
A semiconductor package comprising:
- a substrate;
- a plurality of semiconductor chips stacked on the substrate, wherein the semiconductor chips have slant lower surfaces, and slant directions of the slant lower surfaces of the semiconductor chips are alternately directed;
- a plurality of connection pads arranged at edge portions of upper surfaces of the semiconductor chips;
- a plurality of spacers arranged between the semiconductor chips to expose the connection pads;
- and
- a plurality of bonding wires coupling the connection pads and the substrate.
3 more elements
Dependencies are inferred from the claim text.