Three dimensional semiconductor device

A three-dimensional semiconductor device comprising:

• a conductive plate defining four sides and four recesses formed in the four sides, respectively, wherein the conductive plate has first and second surfaces opposite to each other;
• a plurality of conductive leads located in the recess, respectively, wherein the conductive leads have first and second surfaces opposite to each other;
• a first semiconductor die attached onto an upper central area of the conductive plate;
• a second semiconductor die attached onto a lower central area of the conductive plate;
• a plurality of first conductive wires electrically connecting the first semiconductor die to the conductive leads;
• a plurality of second conductive wires electrically connecting the second semiconductor die to the conductive leads;
• and
• an encapsulant enclosing, as in a capsule, the conductive plate, the conductive leads, the first and second semiconductor dies, and the first and second conductive wires such that the first and second surfaces of the conductive plate and the first and second surfaces of the conductive leads are exposed to outside;
• and
• wherein the conductive plate further has:
• a third surface opposite to the first surface, located between the first and second surfaces, wherein the third surface connects the recesses with each other, and wherein the first semiconductor die is attached onto a central portion of the third surface;
• and
• a fourth surface opposite to the first surface, located between the first and second surfaces, wherein the third surface connects the recesses with each other, and wherein the second semiconductor die is attached onto a central portion of the fourth surface.

A three-dimensional semiconductor device comprising:

• a conductive plate defining four sides and four recesses formed in the four sides, respectively, wherein the conductive plate has first and second surfaces opposite to each other;
• a plurality of conductive leads located in the recess, respectively, wherein the conductive leads have first and second surfaces opposite to each other;
• a first semiconductor die attached onto an upper central area of the conductive plate;
• a second semiconductor die attached onto a lower central area of the conductive plate;
• a plurality of first conductive wires electrically connecting the first semiconductor die to the conductive leads;
• a plurality of second conductive wires electrically connecting the second semiconductor die to the conductive leads;
• an encapsulant enclosing, as in a capsule, the conductive plate, the conductive leads, the first and second semiconductor dies, and the first and second conductive wires such that the first and second surfaces of the conductive plate and the first and second surfaces of the conductive leads are exposed to outside;
• and
• further comprising at least one third semiconductor die attached onto the third or fourth surface of the conductive plate, wherein the third semiconductor die is electrically connected to the third or fourth surface of the conductive leads by a third conductive wire, and wherein the third semiconductor die and the third conductive wire are enclosed by the encapsulant.