Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array package
AssigneeSTATS ChipPAC, Ltd.
InventorMarcos Karnezos
Life of this patent
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Abstract
A single metal layer tape substrate includes a patterned metal layer affixed to a patterned dielectric layer. The dielectric layer is patterned to provide openings exposing lands and bond sites on bond fingers on the land side of the metal layer. The metal layer is patterned to provide circuit traces as appropriate for interconnection with the die and with other elements. Interconnection with a die is made by wire bonding to exposed traces on a die attach side of the metal layer, and bond fingers and lands for access to testing the package are provided on the land side of the metal layer.
Claims30
A single metal layer semiconductor package comprising:
- a die;
- a patterned metal layer having a land side and a die attach side opposite the land side, the patterned metal layer comprising circuit traces for interconnection with the die on the die attach side;
- and
- a patterned dielectric layer affixed to the land side of the patterned metal layer and having openings exposing bond sites on bond fingers on the land side, the openings extend as a window across two or more of the bond fingers, the patterned dielectric layer having additional openings exposing test sites on the patterned metal layer, separate from the die, corresponding to each of the bond fingers, the additional openings adjacent to the window.
A method for making a single metal layer substrate package comprising:
- providing a substrate dielectric layer, patterned to provide openings for bond finger sites and to provide additional openings for test sites, and the dielectric layer having a vertical exterior edge;
- affixing a metal layer onto a surface of the dielectric layer;
- patterning the metal layer to form bond sites on bond fingers over the openings and to form test sites over the additional openings, the test sites corresponding to each of the bond fingers, the openings extending as a window across two or more of the bond fingers, and the additional openings adjacent to the window;
- and
- attaching a die to the metal layer and separate from the test sites.
Dependencies are inferred from the claim text.