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US 8,410,595 B2Granted
Semiconductor device with chip mounted on a substrate
AssigneeQimonda AG
InventorsSteffen Kroehnert, Kerstin Nocke, Juergen Grafe, Kashi Vishwanath Machani
Life of this patent
Estimating the term…
Abstract
A semiconductor device is disclosed. At least one semiconductor chip is mounted on a substrate and is contacted to contact elements of the substrate. The encapsulation of the semiconductor chip includes the substrate, a cover and a pocket within the connected substrate and cover. The pocket is able to fix the chip in its position, and the cover is composed of the same material as the substrate.
Claims42
A semiconductor device with a chip mounted on a substrate, the semiconductor device comprising:
- a chip having an active side and a rear side and also having lateral faces and having chip contacts on the active side;
- a substrate having a first side and a second side, wherein the chip is arranged over the first side of the substrate and at least partially overlies the first side, the substrate having contacts arranged on the second side, the contacts being electrically connected to the chip contacts;
- a cover connected to the substrate, wherein the cover and the substrate encapsulate the chip on all sides, the chip being fixed in position within a pocket formed by the connected cover and the substrate, wherein the cover and the substrate comprise the same material;
- and
- at least one joint between one of two mutually opposite lateral faces of the chip and the pocket, and wherein at least one wall of the pocket adjacent the joint has lateral spacers for laterally fixing the chip in position.
2 more elements
A semiconductor device with a chip mounted on a substrate, the semiconductor device comprising:
- a chip having an active side and a rear side and also having lateral faces and having chip contacts on the active side;
- a substrate having a first side and a second side, wherein the chip is arranged over the first side of the substrate and at least partially overlies the first side, the substrate having contacts arranged on the second side, the contacts being electrically connected to the chip contacts;
- a cover connected to the substrate, wherein the cover and the substrate encapsulate the chip on all sides, the chip being fixed in position within a pocket formed by the connected cover and the substrate, wherein the cover and the substrate comprise the same material;
- wherein a depth of the pocket is slightly larger than a height of the chip such that there is a gap between the chip and the substrate;
- and
- at least one distance holder on which the chip's outer edges bear at least in sections and which are formed by a plate-like additional frame, which has at least one passage and is connected in planar fashion to the substrate or to a substrate base and is composed of the same material as the substrate.
3 more elements
A semiconductor device with a chip mounted on a substrate, the semiconductor device comprising:
- a chip having an active side and a rear side and also having lateral faces and having chip contacts on the active side;
- a substrate having a first side and a second side, wherein the chip is arranged over the first side of the substrate and at least partially overlies the first side, the substrate having contacts arranged on the second side, the contacts being electrically connected to the chip contacts;
- a cover connected to the substrate, wherein the cover and the substrate encapsulate the chip on all sides, the chip being fixed in position within a pocket formed by the connected cover and the substrate, wherein the cover and the substrate comprise the same material;
- wherein the substrate has at least one opening that corresponds in terms of position, size and shape to the chip contacts such that all the chip contacts can be contacted through the at least one opening;
- distance holders that adjust a gap between the active side of the chip and the substrate;
- and
- at least one further distance element arranged between the chip and the substrate adjacent to a bonding channel.
4 more elements
A semiconductor device with a chip mounted on a substrate, the semiconductor device comprising:
- a chip having an active side and a rear side and also having lateral faces and having chip contacts on the active side;
- a substrate having a first side and a second side, wherein the chip is arranged over the first side of the substrate and at least partially overlies the first side, the substrate having contacts arranged on the second side, the contacts being electrically connected to the chip contacts;
- a cover connected to the substrate, wherein the cover and the substrate encapsulate the chip on all sides, the chip being fixed in position within a pocket formed by the connected cover and the substrate, wherein the cover and the substrate comprise the same material;
- wherein the chip is arranged face down above the substrate, the substrate having vias extending from the first side to the second side such that a respective path is defined through each of the vias up to the respective chip contact;
- and
- wherein a depth of the pocket is slightly larger than a height of the chip, a gap between the chip and the substrate being filled with a resist mask having mask openings in an area of the chip contacts and in an area of the vias.
3 more elements
A semiconductor component comprising:
- a plurality of semiconductor devices, each semiconductor device comprising:
- a chip having an active side and a rear side and also having lateral faces and having chip contacts on the active side;
- a substrate
- having a first side and a second side, wherein the chip is arranged over the first side of the substrate and at least partially overlies the first side, the substrate having contacts arranged on the second side, the contacts being electrically connected to the chip contacts, wherein the contacts arranged on the second side of the substrate comprise external contacts for making electrical contact with the semiconductor device, the external contacts being electrically connected to the chip contacts;
- and a cover connected to the substrate, wherein the cover and the substrate encapsulate the chip on all sides, the chip being fixed in position within a pocket formed by the connected cover and the substrate,
- wherein
- the substrate and the cover of each semiconductor device of the plurality of semiconductor devices comprise the same material,
- the semiconductor devices are stacked one above another, and
- the external contacts of at least one semiconductor device are electrically connected to external contacts of the semiconductor component by means of interconnections and vias;
- and at least one distance holder on which the chip's outer edges bear at least in sections and which are formed by a plate-like additional frame, which has at least one passage and is connected in planar fashion to the substrate or to a substrate base and is composed of the same material as the substrate;
- distance holders that adjust a gap between the active side of the chip and the substrate;
- and at least one further distance element arranged between the chip and the substrate adjacent to a bonding channel;
- a gap between the chip and the substrate being filled with a resist mask having mask openings in an area of the chip contacts and in an area of the vias;
- wherein:
- the substrate comprises chip air vents extending through the substrate, a depth of the pocket is slightly larger than a height of the chip and there is a gap between the chip and the substrate, a resist mask is arranged within the gap and covering the substrate, the resist mask having mask openings in an area of the chip contacts and in an area of the vias, and an air film is formed between the resist mask and the chip, the air film being in fluid communication with a surrounding environment through the chip air vents.
12 more elements
A component for mounting chips in a semiconductor device or a semiconductor package, the component comprising:
- a frame;
- a base connected to the frame;
- and
- a pocket for a chip to be accommodated, the pocket formed from a first opening in the frame which ends on the base, the pocket having a height, a size and a shape that are at least as great as a height, a size and a shape of the chip to be accommodated;
- wherein the pocket has an outline that is slightly larger than a footprint of the chip to be accommodated and wherein at least two of opposing walls of the pocket have projections that project into the pocket to fix the chip to be accommodated in position.
2 more elements
A component for mounting chips in a semiconductor device or a semiconductor package, the component comprising:
- a frame;
- a base connected to the frame;
- a pocket for a chip to be accommodated, the pocket formed from a first opening in the frame which ends on the base, the pocket having a height, a size and a shape that are at least as great as a height, a size and a shape of the chip to be accommodated;
- and
- a redistribution layer at least on a surface that is opposite to a surface from which the pocket extends.
2 more elements
A component for mounting chips in a semiconductor device or a semiconductor package, the component comprising:
- a frame;
- a base connected to the frame;
- a pocket for a chip to accommodated, the pocket formed from a first opening in the frame which ends on the base, the pocket having a height, a size and a shape that are at least as great as a height, a size and a shape of the chip to be accommodated;
- and
- wherein:
- the base comprises a redistribution layer on both of its sides, the redistribution layer including electrically conductive contact pads and vias;
- and at least a pair of the contact pads arranged on opposite sides of the base, the pair of contact pads being electrically interconnected by the redistribution layer and the vias.
4 more elements
A component for mounting chips in a semiconductor device or a semiconductor package, the component comprising:
- a frame;
- a base connected to the frame;
- a pocket for a chip to be accommodated, the pocket formed from a first opening in the frame which ends on the base, the pocket having a height, a size and a shape that are at least as great as a height, a size and a shape of the chip to be accommodated;
- and
- wherein a plurality of pockets are arranged in a matrix such that pockets of a row or of a column of the matrix are connected to one another and to a respective cavity at each end of the row or column by channel-like connections.
2 more elements
A semiconductor package including at least two chips, the semiconductor package comprising:
- a first chip having an active side and a rear side and side faces, the first chip including chip contacts on the active side;
- a second chip having an active side and a rear side and side faces, the second chip including chip contacts on the active side;
- a first component a first frame, a first base connected to the first frame, and a first pocket formed from a first opening in the first frame which ends on the first base, the first chip being fixed in position in the first pocket of the first component, the active side of the first chip facing the first base of the first component, and the chip contacts of the first chip being electrically connected with first contact pads of the first base of the first component;
- a second component comprising a second frame, a second base connected to the second frame, and a second pocket formed from a first opening in the second frame which ends on the second base, the second chip being fixed in position in the second pocket of the second component, the active side of the second chip facing the second base of the second component, the chip contacts of the second chip being electrically connected with second contact pads of the second base of the second component, wherein the second component is stacked above the first component in such a way that the first base of the first component is joined to the second frame of the second component;
- and a cover joined to the first frame of the first component and closing off the first pocket of the first component.
2 more elements
Dependencies are inferred from the claim text.