Semiconductor module with multiple semiconductor chips

A circuit board with at least one semiconductor module comprising:

• a plurality of semiconductor chips each with
• a power supply electrode on its back for applying a supply potential
• a power output electrode on its top side for transferring an output current to power outputs of the semiconductor module, and
• a control electrode for switching the semiconductor chip;
• a plurality of leads on the underside of the semiconductor module comprising:
• supply leads, each of the semiconductor chips being mounted with its power supply electrode on a supply lead,
• output leads electrically connected to the power output electrodes, the semiconductor chips are not mounted on the output leads,
• signal leads electrically connected to the control electrodes or the power output electrodes,
• wherein the circuit board has at least two supply potential rails which are arranged in parallel adjacently to one another in accordance with the supply leads of the semiconductor module and wherein the circuit board has perpendicularly to the supply potential rails power output terminals for the output leads of the semiconductor module on one side of the supply potential rails and signal input terminals for the signal leads of the semiconductor module on an opposite side.

A circuit board with at least one semiconductor module comprising:

• semiconductor chips each with
• a power supply electrode on its back for applying a supply potential
• a power output electrode on its top side for transferring an output current to power outputs of the semiconductor module, and
• a control electrode for switching the semiconductor chip;
• leads on the underside of the semiconductor module comprising:
• supply leads on which the semiconductor chips are arranged with their power supply electrodes,
• output leads which are effectively connected to the power output electrodes,
• signal leads which are effectively connected to the control electrodes or the power output electrodes,
• wherein the circuit board has at least two supply potential rails which are arranged in parallel adjacently to one another in accordance with the supply leads of the semiconductor module and wherein the circuit board has perpendicularly to the supply potential rails power output terminals for the output leads of the semiconductor module on one side of the supply potential rails and signal input terminals for the signal leads of the semiconductor module on an opposite side, and
• wherein at least one capacitor or one coil is arranged between a supply potential rail with low supply potential and a power output terminal.

A circuit board with at least one semiconductor module comprising:

• semiconductor chips each with
• a power supply electrode on its back for applying a supply potential
• a power output electrode on its top side for transferring an output current to power outputs of the semiconductor module, and
• a control electrode for switching the semiconductor chip;
• leads on the underside of the semiconductor module comprising:
• supply leads on which the semiconductor chips are arranged with their power supply electrodes,
• output leads which are effectively connected to the power output electrodes,
• signal leads which are effectively connected to the control electrodes or the power output electrodes,
• wherein the circuit board has at least two supply potential rails which are arranged in parallel adjacently to one another in accordance with the supply leads of the semiconductor module and wherein the circuit board has perpendicularly to the supply potential rails power output terminals for the output leads of the semiconductor module on one side of the supply potential rails and signal input terminals for the signal leads of the semiconductor module on an opposite side, and
• wherein the signal input terminals are electrically connected via conductor tracks of the circuit board to at least one integrated control circuit of a control IC which drives both nodes and the control electrodes of semiconductor chips of a half bridge circuit and is arranged on the circuit board to the side perpendicular to the supply potential rails on which the signal input terminals are arranged.

A method of using a circuit board with at least one semiconductor module for an on-board system with a semiconductor module in multi-chip module (MCM) construction, wherein the semiconductor module comprises:

• a plurality of semiconductor chips each with
• a power supply electrode on its back for applying a supply potential
• a power output electrode on its top side for transferring an output current to power outputs of the semiconductor module, and
• a control electrode for switching the semiconductor chip;
• a plurality of leads on the underside of the semiconductor module comprising:
• supply leads, each of the semiconductor chips being mounted with its power supply electrode on a supply lead,
• output leads electrically connected to the power output electrodes, the semiconductor chips are not mounted on the output leads,
• signal leads electrically connected to the control electrodes or the power output electrodes,
• and wherein the circuit board has at least two supply potential rails which are arranged in parallel adjacently to one another in accordance with the supply leads of the semiconductor module and wherein the circuit board has perpendicularly to the supply potential rails power output terminals for the output leads of the semiconductor module on one side of the supply potential rails and signal input terminals for the signal leads of the semiconductor module on an opposite side.

A semiconductor module, comprising:

• a plurality of semiconductor chips, each of the semiconductor chips having a first side and an opposing second side, and each comprising:
• a power supply electrode disposed on the first side of the semiconductor chip,
• a power output electrode disposed on the second side of the semiconductor chip, and
• a control electrode;
• a plurality of supply leads on a first side of the semiconductor module, wherein each of the power supply electrodes is electrically coupled with, and disposed on, one of the supply leads;
• a plurality of signal leads on the first side of the semiconductor module, each of the signal leads is electrically coupled to either one of the control electrodes or one of the power output electrodes;
• a plurality of output leads on the first side of the semiconductor module, each electrically coupled with one of the power output electrodes;
• and
• at least two supply potential rails which are arranged in parallel adjacently to one another in accordance with the supply leads of the semiconductor module,
• wherein the semiconductor module has perpendicularly to the supply potential rails power output terminals for the output leads on one side of the supply potential rails and signal input terminals for the signal leads on an opposite side of the supply potential rails.