Lead frame, resin package, semiconductor device and resin package manufacturing method

A lead frame applied during resin molding of a resin package having a polygonal plane shape, the lead frame comprising:

• an outer frame;
• a plurality of bonding leads extending from the outer frame towards an inside thereof;
• a die pad disposed inside the outer frame and separated from the bonding leads, wherein the die pad has four corners;
• four connecting leads linking the outer frame and the die pad, such that each of the connecting leads connects the outer frame to one of the corners of the die pad, wherein two of the connecting leads are bent, forming spaces between respective corners of the die pad and the outer frame;
• an excess resin reservoir comprising a through hole formed in the outer frame;
• and
• a pressure loss section which connects the excess resin reservoir with one of the spaces between a corner of the die pad and the outer frame, wherein the pressure loss section comprises a depression formed in the outer frame, the depression having a depth less than a thickness of the outer frame,
• wherein the pressure loss section extends in a first direction, the excess resin reservoir extends in a second direction, perpendicular to the first direction, and a width of the pressure loss section, defined in a direction perpendicular to the first direction and to a thickness direction of the outer frame, is smaller than a width of the excess resin reservoir, defined in a direction perpendicular to the second direction and to the thickness direction of the outer frame.