Integrated circuit package system
AssigneeSTATS ChipPAC, Ltd.
InventorsTaesung Lee, Jae Soo Lee, Geun Sik Kim
Life of this patent
Estimating the term…
Abstract
An integrated circuit package system includes a leadframe with leads configured to provide electrical contact between an integrated circuit chip and an external electrical source. Configuring the leads to include outer leads, down set transitional leads, and down set inner leads. Connecting the integrated circuit chip electrically to the down set inner leads. Depositing an encapsulating material to prevent exposure of the down set inner leads.
Claims19
An integrated circuit package system for manufacturing an integrated circuit package comprising:
- providing a leadframe including a paddle and leads for providing electrical contact for an integrated circuit chip, the leads configured to include outer leads, down set transitional leads, and down set inner leads;
- configuring the integrated circuit chip to overlap a portion of the down set inner leads with electrical interconnects therebetween, the paddle physically isolated from the integrated circuit chip and the leads;
- and
- depositing an encapsulating material for preventing exposure of the down set inner leads, an end surface of the outer leads coplanar to a non-horizontal encapsulation side of the encapsulating material.
An integrated circuit package system for manufacturing an integrated circuit package comprising:
- providing a leadframe including a paddle offset from an integrated circuit chip and leads for providing electrical contact between the integrated circuit chip and an external electrical source, the leads including outer leads, down set transitional leads, and down set inner leads;
- configuring the integrated circuit chip to overlap a portion of the down set inner leads with electrical interconnects therebetween, the paddle physically isolated from the integrated circuit and the leads;
- and
- depositing an encapsulating material for preventing exposure of the down set inner leads, an end surface of the outer leads coplanar to a non-horizontal encapsulation side of the encapsulating material.
An integrated circuit package system comprising:
- an integrated circuit chip;
- a leadframe including a paddle and leads configured for providing electrical contact for the integrated circuit chip, the paddle physically isolated from the integrated circuit chip and the leads and the leads configured to include outer leads, down set transitional leads, and down set inner leads;
- an encapsulating material for preventing exposure of the down set inner leads, an end surface of the outer leads coplanar to a non-horizontal encapsulation side of the encapsulating material;
- and
- wherein the integrated circuit chip is configured to overlap a portion of the down set inner leads with electrical interconnects therebetween.
Dependencies are inferred from the claim text.