Semiconductor device packages with electromagnetic interference shielding

A semiconductor package, comprising:

• a substrate including
• a first surface,
• a second opposing surface, and
• a grounding element at least partially extending between the first surface and the second opposing surface of the substrate, the grounding element corresponding to a remnant of a grounding via and including a connection surface disposed adjacent to a peripheral portion of the first surface of the substrate, wherein the connection surface is a curved surface having a concave profile extending from the first surface;
• a package body disposed adjacent to the first surface of the substrate, a periphery of the package body being recessed with respect to a periphery of the substrate, such that the connection surface of the grounding element is exposed adjacent to the peripheral portion of the first surface of the substrate;
• and
• an electromagnetic interference shield disposed adjacent to the package body and directly connected to the connection surface of the grounding element.

A semiconductor package, comprising:

• a substrate including an upper surface, a lower surface, and a grounding element at least partially extending between the upper surface and the lower surface of the substrate, the grounding element including a first surface and a second surface, and at least a portion of the first surface is exposed at a periphery of the substrate, wherein the first surface is a curved surface having a concave profile extending from the upper surface of the substrate, and wherein the first surface is adjacent to the upper surface of the substrate, the second surface is adjacent to the lower surface of the substrate, and the first surface is recessed relative to the second surface;
• a package body disposed adjacent to the upper surface of the substrate;
• and
• an electromagnetic interference shield disposed adjacent to the package body and electrically connected to at least the first surface of the grounding element.