Device having conductive substrate via with catch-pad etch-stop

An electronic device, comprising:

• a substrate having a first conductor on a rear surface thereof and a second conductor over a front surface thereof;
• an electrically conductive multi-layered etch-stop located between a portion of the front surface of the substrate and the second conductor;
• a substrate via extending through the substrate from the rear surface thereof to the multi-layered etch-stop;
• and
• a third conductor in the substrate via electrically coupling the first conductor to the second conductor via the multi-layered etch stop;
• wherein the electrically conductive multi-layered etch-stop comprises a stack of N≧2 double layers, each double layer comprising a first sub-layer of an adhesion or stress relief or both promoting conductor and a second sub-layer of an etch resistant conductor, arranged in either order.

An electronic device, comprising:

• a substrate having an upper surface and a lower surface;
• a semiconductor layer formed over the upper surface of the substrate;
• a dielectric layer formed over the semiconductor layer;
• a catch-pad conductor formed over the dielectric layer;
• a multi-layered etch-stop region formed over the dielectric layer and electrically coupled to the catch-pad conductor;
• and
• a through-substrate via extending from the lower surface of the substrate, through the semiconductor layer, through the dielectric layer, and to the multi-layered etch stop region, the through-substrate via electrically coupled to the catch-pad conductor through the multi-layered etch stop region.