Inductive structure and method of forming the inductive structure with an attached core structure

A method of forming an inductive structure on a conventional semiconductor structure comprising:

• providing a conventionally-formed semiconductor wafer with a cavity formed therein, the bottom surface of the cavity lined with a first non-conductive material;
• providing a first core structure, wherein the first core structure is formed in a conventional manner in a separate process, the first core structure is implemented in a material selected from alloys of (Co)NiFe, NiZn or MnZn;
• placing the first core structure in the cavity using a conventional pick and place machine and adhesively attaching the first core structure to the bottom of the cavity in the semiconductor wafer;
• depositing a second non-conductive layer to touch a top surface of the first core structure filling the remainder of the cavity;
• opening a plurality of openings in the second non-conductive layer to expose the top surface of the first core structure using conventional photolithographic methods;
• forming a first coil, having ends, to touch the second non-conductive layer and laying over a portion of the first core structure;
• depositing forming a third non-conductive layer to touch a top surface of the first coil structure, the top surface of the first core structure and the top surface of the second non-conductive layer;
• forming openings in the third non-conductive layer to expose the top surface of the first core structure using conventional photolithographic methods;
• providing a second core structure wherein the first core structure is formed in a conventional manner in a separate process, the second core structure is implemented in a material selected from alloys of (Co)NiFe, NiZn or MnZn;
• placing the second core structure in the openings in the third no-conductive layer to touch the top surface of the third non-conductive layer using a conventional pick and place machine and adhesively attaching the second core structure to the third non-conductive layer, the second core structure may touch, but is not attached to the first core structure;
• providing conventional back end processing steps, including formation of a passivation layer overlaying the inductive structure and forming openings that expose the top surfaces of the ends of the coil;
• and
• depositing a metal selected from the group of aluminum, aluminum-copper or gold on the ends of the coil prior to dicing and wire-bonding.