Solid-state imaging device and method for producing the same

A solid-state imaging device comprising:

• a first substrate including a light-sensing portion configured to perform photoelectric conversion of incident light and a wiring portion, the first substrate having oppositely facing front and back sides, the front side being a light incident side via which light enters the first substrate, the wiring portion being between the light-sensing portion and the front side;
• an optically transparent second substrate provided over the front side of the first substrate with a space between them;
• a through-hole provided in the first substrate;
• a through-via provided in the through-hole;
• a front-surface-side electrode provided on the front side of the first substrate and connected to the through-via in the through-hole, the through-hole extending to the front-surface-side electrode;
• a back-surface-side electrode connected to the through-via and provided on the back side of the first substrate;
• and
• a stopper electrode provided on the front-surface-side electrode and configured to function as a stopper when the through-hole is formed in the first substrate using energy beam processing, the stopper electrode filling a space between the front-surface-side electrode and the second substrate and a space between the through-via and the second substrate.