Solid image-pickup device with flexible circuit substrate
AssigneeSony Corporation
InventorYukinobu Wataya
Life of this patent
Estimating the term…
Abstract
An improved solid image-pickup device is so formed that its semiconductor device has on its surface an image-pickup area having a plurality of light sensors arranged thereon. A plurality of bonding pads are formed on the surface of the semiconductor device and arranged around the image-pickup area. A plurality of through holes are formed through the semiconductor substrate, extending from the lower surfaces of the bonding pads to the back surface of the semiconductor substrate and each of the through holes is filled with an electrically conductive material, thereby effecting an electric connection between the bonding pads and the copper wire of the flexible circuit substrate bonded to the back surface of the semiconductor substrate.
Claims12
A solid image-pickup device comprising:
- a semiconductor device having a plurality of light sensors located at a first side;
- through holes extending from a second side of said semiconductor device to the first side providing electrical communication between the light sensors and electrical connections at the second side of said semiconductor device;
- a flexible circuit substrate disposed adjacent to the second side of said semiconductor device;
- an insulating film covering inner side surfaces of the through holes;
- and
- an electrically conductive material fully filled in the through holes, wherein the electrically conductive material is in contact with lower surfaces of bonding pads located at the first side providing electrical communication to the light sensors and further wherein the electrically conductive material extends through holes in conductive pads at a side of said semiconductor device that is opposite the side at which the bonding pads are located, thereby electrically connecting the bonding pads and conductive pads, and wherein said flexible circuit substrate has the conductive pads formed thereon and said flexible circuit substrate has holes at locations corresponding to the through holes, the holes in the said flexible circuit substrate extending through the conductive pads and having a substantially larger diameter than the through holes, a portion of the electrically conductive material being over-filled from the openings of the through holes at the second side of said semiconductor device, the electrically conductive material being electrically connected with said flexible circuit substrate.
A solid image-pickup device comprising:
- a semiconductor device having a plurality of light sensors located at a first side;
- a plurality of bonding pads located at the first side adjacent an imaging area at which the plurality of light sensors are located;
- through holes extending from a second side of said semiconductor device to the first side providing electrical communication between the light sensors and electrical connections at the second side of said semiconductor device;
- a flexible circuit substrate disposed adjacent to the second side of said semiconductor device;
- a sealing agent formed over the bonding pads and surrounding the imaging area without extending over the light sensors, wherein an electrically conductive material is provided in the through holes and being in contact with lower surfaces of the bonding pads located at the first side providing electrical communication to the light sensors and further wherein the electrically conductive material extends through holes in conductive pads at the second side of said semiconductor device, thereby electrically connecting the bonding pads and conductive pads, and wherein said flexible circuit substrate has the conductive pads formed thereon and said flexible circuit substrate has holes at locations corresponding to the through holes, the holes in said flexible circuit substrate extending through the conductive pads and having a substantially larger diameter than the through holes, a portion of the electrically conductive material being over-filled from the openings of the through holes at the second side of said semiconductor device, the electrically conductive material being electrically connected with said flexible circuit substrate.
Dependencies are inferred from the claim text.