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US 8,410,564 B2Granted
Semiconductor device, method of manufacturing the same, and wireless transmission system utilizing the same
AssigneeSony Corporation
InventorHirofumi Kawamura
Life of this patent
Estimating the term…
Abstract
A device, and method for manufacturing the same, including a semiconductor package which allows transmission therethrough of a radio signal, a chip which generates the radio signal and a coupler adjacent the chip and effective to radiate the radio signal to outside of the semiconductor package.
Claims11
A device comprising:
- a semiconductor package which allows transmission therethrough of a radio signal;
- a chip which generates the radio signal;
- a coupler adjacent the chip and effective to radiate the radio signal to outside of the semiconductor package;
- a semiconductor layer within the semiconductor package;
- a dielectric layer above the semiconductor layer, the dielectric layer including a transmission path therein;
- a via hole in the dielectric layer;
- a conductor layer on the dielectric layer;
- and
- a pattern in the conductor layer formed by at least two openings in the conductor layer and a portion of the conductor layer in between the openings,
- wherein,
- the semiconductor layer and the dielectric layer form the chip,
- the via hole is operatively connected to the transmission path and the conductor layer, and
- the conductor pattern is effective to improve the strength of the radio signal transmitted between the transmission path and a surface of the semiconductor package.
10 more elements
A device comprising:
- a semiconductor package which allows transmission therethrough of a radio signal;
- a chip which generates the radio signal;
- and
- a coupler adjacent the chip and effective to radiate the radio signal to outside of the semiconductor package;
- a semiconductor layer within the semiconductor package;
- a dielectric layer above the semiconductor layer, the dielectric layer including a transmission path therein;
- a via hole in the dielectric layer;
- a conductor layer on the dielectric layer;
- and
- a pattern in the conductor layer formed by at least two openings in the conductor layer and a portion of the conductor layer in between the openings,
- wherein,
- the semiconductor layer and the dielectric layer form the chip, the via hole is operatively connected to the transmission path and the conductor layer,
- the pattern in the conductor layer includes a plurality of openings in the conductor layer and a plurality of portions of the conductor layer in between the openings, and
- the portions of the conductor layer in the pattern are not electrically connected to each other, and
- one of the portions of the conductor layer is electrically connected to the transmission path.
12 more elements
A semiconductor device comprising:
- a semiconductor layer;
- a semiconductor chip in the semiconductor layer;
- a dielectric layer on the semiconductor layer;
- an encapsulation member on the dielectric layer to encapsulate the semiconductor chip;
- a transmission path in-between the dielectric layer and the encapsulation member on the dielectric layer;
- a conductor layer on the surface of the encapsulation member;
- and
- a slot structure comprising an opening in the conductor layer.
5 more elements
A semiconductor device comprising:
- a semiconductor layer;
- a semiconductor chip including an electric circuit having a communication function, the semiconductor chip in the semiconductor layer;
- a dielectric layer on the semiconductor layer;
- an encapsulation member on the dielectric layer to encapsulate the semiconductor chip;
- a transmission path effective to transmit a high-frequency signal to and from the electric circuit;
- a conductor layer facing the transmission path;
- a slot structure comprising an opening in the conductor layer,
- wherein,
- the transmission path and the slot structure are coupled to each other and are effective to transmit an electromagnetic wave between the transmission path and the encapsulation member.
6 more elements
An electronic apparatus comprising:
- a semiconductor package which allows transmission therethrough of a radio signal;
- a chip which generates the radio signal;
- a coupler adjacent the chip and effective to radiate the radio signal to outside of the semiconductor package;
- a semiconductor layer within the semiconductor package;
- a dielectric layer above the semiconductor layer, the dielectric layer including a transmission path therein;
- a via hole in the dielectric layer;
- a conductor layer on the dielectric layer;
- and
- a pattern in the conductor layer formed by at least two openings in the conductor layer and a portion of the conductor layer in between the openings,
- wherein,
- the semiconductor layer and the dielectric layer form the chip,
- the via hole is operatively connected to the transmission path and the conductor layer, and
- the conductor pattern is effective to improve the strength of the radio signal transmitted between the transmission path and a surface of the semiconductor package.
10 more elements
Dependencies are inferred from the claim text.