Electronic device and method for manufacturing thereof
AssigneeSeiko Epson Corporation
InventorsAkira Sato, Toru Watanabe, Shogo Inaba, Takeshi Mori
Life of this patent
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Abstract
An electronic device, including a substrate, a functional structure constituting a functional element formed on the substrate, and a cover structure forming a cavity portion in which the functional structure is disposed, is disclosed. In the electronic device, the cover structure includes a laminated structure of an interlayer insulating film and a wiring layer, the laminated structure being formed on the substrate in such a way that it surrounds the cavity portion, and the cover structure has an upside cover portion covering the cavity portion from above, the upside cover portion being formed with part of the wiring layer that is disposed above the functional structure.
Claims17
An electronic device comprising:
- a substrate;
- a functional element formed above the substrate;
- a guard ring surrounding the functional element, the guard ring being away from the functional element;
- a first cover layer formed above the guard ring and the functional element, the first cover layer being away from the functional element, the first cover layer including at least one hole;
- and
- a second cover layer formed above the first cover layer.
An electronic device comprising:
- a substrate;
- a functional element formed above the substrate;
- a guard ring surrounding the functional element, the guard ring being spaced at a distance away from the functional element;
- a first cover layer formed above the guard ring and the functional element, the first cover layer being spaced away from the functional element, the first cover layer including at least one first hole;
- a second cover layer formed above the first cover layer, the second cover layer including at least one second hole;
- and
- a third cover layer formed above the second cover layer.
Dependencies are inferred from the claim text.