Substrate with embedded patterned capacitance
AssigneeKemet Electronics Corporation
InventorsJohn D. Prymak, Chris Stolarski, Alethia Melody, Antony P. Chacko, Gregory J. Dunn
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Abstract
A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.
Claims12
A layered substrate comprising:
- a first substrate;
- a valve metal conductive foil laminated to said first substrate wherein said valve metal conductive foil comprises a valve metal oxide dielectric thereon;
- a cathode on said dielectric;
- a second substrate forming a layered structure with said valve metal conductive foil and said cathode between said first substrate and said second substrate;
- a first trace on at least one of said first substrate and said second substrate;
- a first via forming an electrical connection between said cathode and said first trace;
- a second trace on at least one of said first substrate and said second substrate;
- and
- a second via forming an electrical connection between said valve metal conductive foil and said second trace.
A layered substrate comprising:
- an embedded capacitor comprising:
- a first substrate wherein said first substrate comprises a material selected from the group consisting of copper, copper coated circuit substrate, polyimide, phenolic and glass reinforced polymer;
- a valve metal conductive foil laminated to said first substrate wherein said valve metal conductive foil comprises a valve metal oxide dielectric thereon;
- a cathode on said dielectric;
- a second substrate forming a layered structure with said valve metal conductive foil and said cathode between said first substrate and said second substrate and wherein said second substrate comprises a material selected from the group consisting of copper, copper coated circuit substrate, polyimide, phenolic and glass reinforced polymer;
- a first trace on at least one of said first substrate and said second substrate;
- a first via forming an electrical connection between said cathode and said first trace;
- a second trace on at least one of said first substrate and said second substrate;
- and
- a second via forming an electrical connection between said valve metal conductive foil and said second trace.
Dependencies are inferred from the claim text.