Solid-state imaging device including a multilayer wiring layer, color filters, lenses, and waveguide groove and manufacturing method for the same

A manufacturing method for a solid-state imaging element comprising:

• a first step of providing a pixel region and a peripheral circuit region on a semiconductor substrate, the pixel region including a plurality of unit pixels, each including a photoelectric conversion element and a gate element, and disposed in a two-dimensional array, the peripheral circuit region provided in a periphery of the pixel region and configured to perform drive control of the pixel region and imaging signal processing;
• a second step of disposing, above the semiconductor element, a multilayer wiring layer including layers of wiring and an interlayer film interposed therebetween, so as to cover the pixel region and the peripheral circuit region except areas above the photoelectric conversion elements;
• a third step of disposing a waveguide member to fill the areas above the photoelectric conversion elements and to cover the multilayer wiring layer at least within the pixel region such that, in each of the areas above the photoelectric conversion elements, a waveguide is formed by the waveguide member and the interlayer film, the waveguide being an optical path for guiding incident light therethrough to a corresponding photoelectric conversion element;
• and
• a fourth step of forming an optical structure that is composed of a color filter material and a lens material above the waveguide member within the pixel region, wherein
• the manufacturing method further comprises:
• a step of forming a groove by removing a portion of the waveguide member covering the multilayer wiring layer from an area within the pixel region along a border between the pixel region and the peripheral circuit region, the groove forming step performed concurrently with or subsequent to the third step, and prior to the fourth step.