Group III nitride semiconductor device and epitaxial substrate
AssigneeSumitomo Electric Industries, Ltd.
InventorsTatsuya Tanabe, Kouhei Miura, Makoto Kiyama, Takashi Sakurada
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AssigneeSumitomo Electric Industries, Ltd.
InventorsTatsuya Tanabe, Kouhei Miura, Makoto Kiyama, Takashi Sakurada
Estimating the term…
Affords Group III nitride semiconductor devices in which the leakage current from the Schottky electrode can be reduced. In a high electron mobility transistor 11, a supporting substrate 13 is composed of AlN, AlGaN, or GaN, specifically. An AlYGa1−YN epitaxial layer 15 has a full-width-at-half maximum of (0002) plane XRD of 150 sec or less. A GaN epitaxial layer 17 is provided between the gallium nitride supporting substrate and the AlYGa1−YN epitaxial layer (0<Y≦1). A Schottky electrode 19 is provided on the AlYGa1−YN epitaxial layer 15. The Schottky electrode 19 constitutes a gate electrode of the high electron mobility transistor 11. The source electrode 21 is provided on the gallium nitride epitaxial layer 15. The drain electrode 23 is provided on the gallium nitride epitaxial layer 15.
A Group III nitride semiconductor device characterized in being furnished with:
An epitaxial substrate for a Group III nitride semiconductor device, said epitaxial substrate characterized in being furnished with:
Dependencies are inferred from the claim text.