Light emitting diode coating method
AssigneeSnu R&Db Foundation
InventorsSunghoon Kwon, Euijoon Yoon, Wook Park
Life of this patent
Estimating the term…
Abstract
Provided is a light emitting diode (hereinafter, referred to as an LED) coating method, and more particularly, an LED coating method that can be used to coat a phosphor, a molding, etc., on an LED. The LED coating method includes (a) preparing a substrate and a plurality of LEDs arranged on the substrate; (b) applying a photoresist onto the substrate and the plurality of LEDs; and (c) selectively exposing the photoresist to light to form a first coating on surfaces of the plurality of LEDs. Here, the first coating is formed by curing the photoresist.
Claims40
A light emitting diode (LED) coating method, comprising:
- (a) preparing substrate and a plurality of LEDs arranged on the substrate;
- (b) applying a photoresist onto the substrate and the plurality of LEDs;
- and
- (c) selectively exposing the photoresist to light to form a first coating on surfaces of the plurality of LEDs, wherein, in step (b), a second coating including a phosphor is formed on surfaces of the plurality of LEDs.
A light emitting diode (LED) coating method, comprising:
- (a) preparing a substrate, a plurality of LEDs arranged on the substrate, and a board;
- (b) introducing a photoresist between the substrate and the board, which are disposed parallel to each other, to sandwich the plurality of LEDs;
- and
- (c) selectively exposing the photoresist to light to form a first coating on surfaces of the plurality of LEDs, wherein the first coating is formed by curing the photoresist,
- wherein, in step (b), a second coating including a phosphor is formed on surfaces of the plurality of LEDs.
A light emitting diode (LED) light source, comprising:
- a substrate;
- an LED disposed on the substrate;
- a first coating covering at least a portion of the LED, the first coating including a cured photoresist and
- a second coating including a phosphor formed on surfaces of the LED.
A light emitting diode (LED) coating method, comprising:
- (a) preparing a substrate and a plurality of LEDs arranged on the substrate;
- (b) applying a photoresist onto the substrate and the plurality of LEDs;
- and
- (c) selectively exposing the photoresist to light to form a first coating on surfaces of the plurality of LEDs, wherein the first coating is formed by curing the photoresist,
- wherein a portion of each upper surface of the plurality of LEDs is not covered by the first coating while another portion of each upper surface of the plurality of LEDs is covered by the first coating.
A light emitting diode (LED) coating method, comprising:
- (a) preparing a substrate, a plurality of LEDs arranged on the substrate, and a board disposed over and above the plurality of LEDs to be substantially parallel to the substrate to sandwich the plurality of LEDs;
- (b) introducing a photoresist to fill a gap between the substrate and the board;
- and
- (c) selectively exposing the photoresist to light to form a first coating on surfaces of the plurality of LEDs, wherein the first coating is formed by curing the photoresist,
- wherein a thickness of the first coating disposed on an upper surface of each of the plurality of LEDs is adjusted by a distance between the substrate and the board.
A light emitting diode (LED) light source, comprising:
- a substrate;
- an LED disposed on the substrate;
- and
- a coating for covering at least a portion of the LED, the coating including a cured photoresist,
- wherein the coating does not cover a portion of an upper surface of the LED while covering another portion of the upper surface of the LED.
Dependencies are inferred from the claim text.