Light emitting device package
AssigneeLG Innotek Co., Ltd.
InventorBum Chul Cho
Life of this patent
Estimating the term…
Abstract
Provided is a light emitting device package. The light emitting device package comprises a first conductive type package body, an insulating layer comprising an opening on the package body, a plurality of compound semiconductor layers disposed on the package body through the opening of the insulating layer, an electrode electrically connected to the plurality of compound semiconductor layers, a first metal layer electrically connected to the package body and disposed on a part of the insulating layer, and a second metal layer electrically connected to the electrode and disposed on the other part of the insulating layer.
Claims16
A light emitting device package comprising:
- a first conductive type package body;
- an insulating layer comprising a first opening on a top surface of the package body;
- a plurality of compound semiconductor layers disposed on the package body through the first opening of the insulating layer;
- an electrode electrically connected to the plurality of compound semiconductor layers;
- a first metal layer electrically connected to the package body and disposed on a part of the insulating layer;
- a second metal layer electrically connected to the electrode and disposed on the other part of the insulating layer;
- and
- a protection device disposed on the package body, the protection device electrically connected to the first metal layer and the second metal layer,
- wherein the plurality of compound semiconductor layers comprises a conductive type buffer layer disposed on the top surface of the package body,
- wherein the conductive type buffer layer contacts the top surface of the package body,
- wherein the conductive type buffer layer is formed of a semiconductor doped with a first conductive type dopant, and
- wherein the protection device comprises:
- a first well connected to the first metal layer, the first well having a polarity opposite to that of the package body;
- and
- a second well connected to the second metal layer at a portion of the first well, the second well having the same polarity as the package body.
A light emitting device package comprising:
- a first conductive type package body comprising a cavity in an upper portion thereof;
- an insulating layer on the package body;
- a plurality of compound semiconductor layers comprising a conductive type buffer layer contacting a bottom surface of the cavity of the package body;
- an electrode on the plurality of compound semiconductor layers;
- a first metal layer electrically connected to the package body and disposed on a part of the insulating layer;
- a second metal layer electrically connected to the electrode and disposed on the other part of the insulating layer;
- and
- a plurality of wells in which ions are diffused or injected on the package body,
- wherein the plurality of wells selectively contacts the first and second metal layers,
- wherein the conductive type buffer layer physically contacts the bottom surface of the cavity,
- wherein the conductive type buffer layer is formed of a semiconductor doped with a first conductive type dopant, and
- wherein the plurality of compound semiconductor layers further comprises:
- a first conductive type semiconductor layer on the conductive type buffer layer;
- an active layer on the first conductive type semiconductor layer;
- and
- a second conductive type semiconductor layer between the active layer and the electrode,
- wherein the first conductive type buffer layer is electrically connected to the first conductive type semiconductor layer.
Dependencies are inferred from the claim text.