Back to results
US 8,410,509 B2Granted
Light emitting diode module for line light source
AssigneeSamsung Electronics Co., Ltd.
InventorIl Ku Kim
Life of this patent
Estimating the term…
Abstract
A light emitting diode module for a line light source includes a circuit board having a wire pattern formed thereon and a plurality of LED chips directly mounted and disposed in a longitudinal direction on the circuit board and electrically connected to the wire pattern. The module also includes a reflecting wall installed on the circuit board to surround the plurality of LED chips, reflecting light from the LED chips. The module further includes a heat sink plate underlying the circuit board to radiate heat generated from the LED chip.
Claims12
A light emitting diode module for a line light source, comprising:
- a circuit board with a wire pattern formed thereon;
- a plurality of light emitting diode chips mounted on the circuit board and electrically connected to the wire pattern, the light emitting diode chips disposed in a longitudinal direction of the circuit board to form the line light source;
- a reflecting wall disposed on an upper surface of the circuit board in contact with the upper surface of the circuit board to completely surround an outline of the line light source comprising the plurality of light emitting diode chips, the reflecting wall for reflecting light from the plurality of light emitting diode chips in the line light source;
- a resin encapsulant for sealing all of the light emitting diode chips together;
- and
- a heat sink plate underlying the circuit board to radiate heat generated from the light emitting diode chips,
- wherein the circuit board comprises a ceramic circuit board, and vias perforated through the circuit board under the light emitting diode chips, respectively, to assist radiation of heat generated from the light emitting diode chips to the heat sink plate,
- the reflecting wall comprises a non-conductive wall structure having a highly reflective metal layer coated on an inner side thereof, and the non-conductive wall structure comprises a ceramic material that is integral with the circuit board.
5 more elements
Dependencies are inferred from the claim text.