Light emitting diode (LED) package having wavelength conversion member and wafer level fabrication method

A light emitting diode (LED) package comprising:

• a substrate having a first side, a die-mounting pad on the first side, a first conductor on the first side in electrical communication with the die mounting pad and a second conductor on the first side;
• a light emitting diode (LED) die in electrical contact with the die-mounting pad having a foot print, a circuit side, a die contact on the circuit side and a plurality of edges, the (LED) die configured to emit electromagnetic radiation in a first spectral region;
• a dielectric layer on the circuit side and edges of the (LED) die and on the substrate;
• a wavelength conversion member on the dielectric layer comprising a sheet containing a wavelength conversion compound configured to convert the electromagnetic radiation in the first spectral region to electromagnetic radiation in a second spectral region, the wavelength conversion member having a peripheral shape substantially matching the footprint of the (LED) die, a front surface and sidewalls;
• an interconnect comprising a conductive trace on the front surface of the wavelength conversion member and extending along a sidewall of the wavelength conversion member and on the dielectric layer on the edges of the (LED) die in electrical contact with the die contact and with the second conductor;
• a first conductive via comprising a first opening through the wavelength conversion member filled with a conductive material in electrical contact with the interconnect and a second conductive via comprising a second opening through the dielectric layer filled with the conductive material in electrical contact with the interconnect;
• and
• a transparent dome configured as a lens encapsulating the (LED) die.

A method for fabricating a light emitting diode (LED) package comprising:

• providing a substrate having a die mounting pad, a first conductor in electrical communication with the die mounting pad and a second conductor;
• attaching a light emitting diode (LED) die to the substrate in electrical contact with the die mounting pad having a foot print, a circuit side, a die contact on the circuit side and a plurality of edges, the (LED) die configured to emit electromagnetic radiation in a first spectral region;
• forming a dielectric layer on the circuit side and edges of the (LED) die and on the substrate;
• forming a wavelength conversion member configured to convert the electromagnetic radiation in the first spectral region to electromagnetic radiation in a second spectral region, the wavelength conversion member having a peripheral shape substantially matching the footprint of the (LED) die, a front surface and sidewalls;
• attaching the wavelength conversion member to the dielectric layer;
• forming an interconnect comprising a conductive trace comprising a conductive material on the front surface of the wavelength conversion member and extending along sidewall of the wavelength conversion member and on the dielectric layer on the edges of the (LED) die having a first conductive via comprising a first opening in the wavelength conversion member filled with the conductive material in electrical contact with the die contact and a second conductive via comprising a second opening in the dielectric layer filled with the conductive material in electrical contact with the second conductor;
• and
• forming a transparent dome configured as a lens encapsulating the (LED) die.