Solid-state imaging device, method for manufacturing the same, and imaging apparatus
AssigneeSony Corporation
InventorsTetsuji Yamaguchi, Yuko Ohgishi, Takashi Ando, Harumi Ikeda
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AssigneeSony Corporation
InventorsTetsuji Yamaguchi, Yuko Ohgishi, Takashi Ando, Harumi Ikeda
Estimating the term…
Realization of an adequate hole accumulation layer and reduction in dark current are allowed to become mutually compatible. A solid-state imaging device 1 having a light-receiving portion 12 to photoelectrically convert incident light is characterized by including a film 21, which is disposed on a light-receiving surface 12s of the above-described light-receiving portion 12 and which lowers an interface state, and a film 22, which is disposed on the above-described film 21 to lower the interface state and which has a negative fixed charge, wherein a hole accumulation layer 23 is disposed on the light-receiving surface 12s side of the light-receiving portion 12.
A solid-state imaging device comprising a light-receiving portion operative to photoelectrically convert incident light includes:
An imaging apparatus characterized by comprising:
A method for manufacturing a solid-state imaging device having a light-receiving portion operative to photoelectrically convert incident light comprising:
Dependencies are inferred from the claim text.