Switch structure on sidewall of circuit board for electronic device
AssigneeWistron Corporation
InventorsChih-Feng Yeh, Wen-Nan Hsia, Cheng-Ju Lee
Life of this patent
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Abstract
A switch structure on the sidewall of a circuit board for an electronic device and manufacturing methods of the circuit board are provided. The switch structure includes a circuit board, a plurality of conductive portions, and a movable unit. The conductive portions are formed on a sidewall of the circuit board and electrically insulated from each other. The movable unit is disposed corresponding to the conductive portions to electrically connect or disconnect the plurality of conductive portions to achieve the switch function. The switch structure utilizes the structural design of the circuit board to reduce the space on the circuit board preserved for a circuit board switch.
Claims30
A switch device for use in an electronic device, comprising:
- a circuit board including a sidewall, the circuit board formed from a first layer, a second layer, and a third layer stacked in sequence;
- a plurality of conductive portions formed on the sidewall, wherein the plurality of conductive portions are electrically insulated from each other by the second layer;
- and
- a movable unit including at least a conducting part and moving between a first position and a second position, wherein when the conducting part of the movable unit is at the first position, the plurality of conductive portions remain electrically insulated from each other;
- when the conducting part of the movable unit is at the second position, at least two of the plurality of conductive portions are electrically connected via the conducting part.
A method for manufacturing a switch device, comprising:
- stacking a first layer, a second layer, and a third layer to form a circuit board with the second layer sandwiched between the first layer and the third layer, wherein sidewalls of the first layer, the second layer, and the third layer jointly form a sidewall of the circuit board;
- forming a first conductive portion and a third conductive portion on the sidewalls of the first layer and the third layer, respectively by forming at least a flange on the sidewall of the circuit board and forming the first conductive portion and the third conductive portion on the flange, wherein the flange is formed with a protrusion on each of the sidewalls of the first layer and the third layer;
- and
- adjusting the circuit board, so that the first conductive portion and the third conductive portion is selectively electrically connected and disconnected.
Dependencies are inferred from the claim text.