Printed wiring board and method for manufacturing the same
AssigneeIbiden Co., Ltd.
InventorsMasahiro Kaneko, Satoru Kose, Hirokazu Higashi
Life of this patent
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Abstract
A printed wiring board includes an interlayer resin insulation layer having a penetrating hole for a via conductor, a conductive circuit formed on one surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and having a protruding portion protruding from the other surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the protruding portion of the via conductor. The via conductor is connected to the conductive circuit and has a first conductive layer formed on the side wall of the penetrating hole and a plated layer filling the penetrating hole.
Claims20
A printed wiring board comprising:
- an interlayer resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the interlayer resin insulation layer having a penetrating hole;
- a conductive circuit formed on the first surface of the interlayer resin insulation layer;
- a via conductor formed in the penetrating hole and having a protruding portion protruding from the second surface of the interlayer resin insulation layer;
- and
- a surface-treatment coating formed on a surface of the protruding portion of the via conductor,
- wherein the via conductor is connected to the conductive circuit and comprises a first conductive layer formed on a side wall of the penetrating hole and a plated material filling the penetrating hole.
Dependencies are inferred from the claim text.