Wiring board and method of manufacturing the same
AssigneeShinko Electric Industries Co., Ltd.
InventorsYoshitaka Matsushita, Kazuhiro Oshima, Akio Horiuchi
Life of this patent
Estimating the term…
Abstract
A wiring board has a wiring member, a first reinforcing member and a second reinforcing member. The wiring member has wiring layers and insulating layers which are stacked, and the wiring layers include a first connecting electrode formed on a surface of the wiring member and a second connecting electrode formed on a back surface of the wiring member. A pin is formed on the second connecting electrode. The second reinforcing member is formed by a resin and serves to reinforce the wiring member. The first reinforcing member is formed on the whole back surface of the wiring member except for the pin provided on the second connecting electrode.
Claims12
A wiring board comprising:
- a wiring member formed of alternatingly stacked wiring layers and insulating layers, the wiring layers including a first connection pad formed on a first surface of the wiring member and a second connection pad formed on a second surface of the wiring member, the second surface of the wiring member being a surface opposite to the first surface of the wiring member;
- a solder resist layer formed on the second surface of the wiring member and having a first opening portion so that the second connection pad is not covered by the solder resist layer, the solder resist layer being formed on an outermost surface layer of the wiring member;
- an external connecting terminal formed on the second connection pad;
- a first reinforcing member formed on the solder resist layer, the first reinforcing member including a filler material and covering the first opening portion of the solder resist layer, the first reinforcing member forming a first outermost layer of the wiring board;
- and
- a second reinforcing member formed on the first surface of the wiring member and having a second opening portion extending through the second reinforcing member at a central part of the second reinforcing member, the second reinforcing member forming a second outermost layer of the wiring board, the second opening portion exposing the first connection pad,
- wherein the first and the second reinforcing members are configured to reinforce the wiring board.
A wiring board comprising:
- a wiring member formed of alternatingly stacked wiring layers and insulating layers, the wiring layers including a first connection pad formed on a first surface of the wiring member and a second connection pad formed on a second surface of the wiring member, the second surface of the wiring member being a surface opposite to the first surface of the wiring member;
- a solder resist layer formed on the second surface of the wiring member and having a first opening portion so that the second connection pad is not covered by the solder resist layer, the solder resist layer being formed on an outermost surface layer of the wiring member;
- an external connecting terminal formed on the second connection pad;
- a first reinforcing member formed on the solder resist layer, the first reinforcing member including a filler material, the first reinforcing member forming a first outermost layer of the wiring board and having a second opening portion;
- and
- a second reinforcing member formed on the first surface of the wiring member and having a third opening portion extending through the second reinforcing member at a central part of the second reinforcing member, the second reinforcing member forming a second outermost layer of the wiring board, the third opening portion exposing the first connection pad;
- wherein the first opening portion in the solder resist layer is coincident with the second opening portion in the first reinforcing member and wherein the first and the second reinforcing members are configured to reinforce the wiring board.
Dependencies are inferred from the claim text.