Printed circuit substrate and method of manufacturing the same
AssigneesSamsung Electro-Mechanics Co., Ltd., Snu R&Db Foundation
InventorsHyung Wook Park, Young Chang Joo, Hong Seok Min, Young Gwan Ko, Chang Sup Ryu, Ho Young Lee, Shin Bok Lee, Min Suk Jung
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Abstract
Disclosed herein are a printed circuit substrate and a method of manufacturing the same. The printed circuit substrate includes an insulating layer, and a circuit layer that includes a circuit pattern disposed on the insulating layer and a barrier layer that is disposed to cover at least one surface of the circuit pattern and suppresses electrochemical migration from the circuit pattern, thereby making it possible to achieve high-density and secure reliability, and the method of manufacturing the same.
Claims7
A printed circuit substrate, comprising:
- an insulating layer;
- and
- a circuit layer that includes a circuit pattern disposed on the insulating layer and a barrier layer that is disposed to cover all surfaces of the circuit pattern and suppresses electrochemical migration from the circuit pattern.
A method of manufacturing a printed circuit substrate, comprising:
- forming a first auxiliary barrier layer on an insulating layer:
- forming a circuit pattern on the first auxiliary barrier layer;
- and
- forming a second auxiliary barrier layer on all exposed surfaces of the circuit pattern;
- and forming a barrier layer which covers all surfaces of the circuit pattern, by annealing the first auxiliary barrier layer, the second auxiliary barrier layer, and the circuit pattern.
Dependencies are inferred from the claim text.