Sealing structure for wire lead-out hole
AssigneeSumitomo Wiring Systems, Ltd.
InventorAnna Nishimura
Life of this patent
Estimating the term…
Abstract
A sealing structure for wire lead-out hole is provided with a wire lead-out hole (11) formed in a case (10), a resilient seal (20) to be mounted into the wire lead-out hole (11), and a bracket (40) for retaining the resilient seal (20) in the wire lead-out hole (11) by being fixed to the case (10). The resilient seal (20) includes a seal main body (21) including a plurality of wire insertion holes (22) for allowing insertion of wires (Y), outer lips (24) formed on the outer peripheral surface of the seal main body (21), inner lips (23) formed on the inner peripheral surfaces of the wire insertion holes (22), and a wire protecting portion (25) provided on the seal main body (21).
Claims8
A sealing structure for wire lead-out hole, comprising:
- a wire lead-out hole formed in a case and having a substantially stepped configuration in which a large-diameter portion and a small-diameter portion are connected;
- a resilient seal mounted in the wire lead-out hole and including:
- a seal main body including at least one wire insertion hole for allowing insertion of at least one wire;
- at least one outer lip formed on an outer peripheral surface of the seal main body and held in close contact with the inner peripheral surface of the large-diameter portion;
- at least one inner lip formed on an inner peripheral surface of the wire insertion hole and held in close contact with the outer peripheral surface of the wire;
- and
- a wire protecting portion projecting from one end surface of the seal main body and provided between the inner peripheral surface of the small-diameter portion and the outer peripheral surface of the wire;
- and
- a retainer fixed to the case and retaining the resilient seal in the wire lead-out hole.
Dependencies are inferred from the claim text.