Underfill flow guide structures and method of using same
AssigneeInternational Business Machines Corporation
InventorsTimothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Marie-Claude Paquet, Wolfgang Sauter, Timothy D. Sullivan
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Abstract
Underfill flow guide structures and methods of using the same are provided with a module. The method includes mounting bumps on a substrate. The method also includes forming underfill flow guide structures on the substrate by patterning wires with an overlay of hard substance. The underfill flow guide structures are integrated with the substrate and formed between adjacent bumps. The underfill flow guide structures are further formed to uniformly guide underfill along the substrate during capillary underfill processing.
Claims15
A method comprising:
- mounting bumps on a substrate;
- and
- forming underfill flow guide structures on the substrate by patterning wires with an overlay of hard substance, the underfill flow guide structures being integrated with the substrate and formed between adjacent bumps, wherein the underfill flow guide structures are further formed to uniformly guide underfill along the substrate during capillary underfill processing.
A method of forming a module, comprising:
- forming C4 bumps on a substrate;
- mounting a carrier to the substrate by the C4 bumps;
- applying underfill within a space formed between the substrate and the carrier;
- and
- forming underfill flow guide structures integrated with the substrate and located between adjacent bumps, and configured to uniformly guide the underfill along the substrate and within the space during underfill processing, wherein the underfill flow guide structures are formed as wires with an overlay of a hard substance.
A method of forming a module, comprising:
- injecting underfill within a space of the module at one or more edges of a substrate forming the module;
- and
- directing the underfill with a substantially uniform flow front with the space of the module by underfill flow guide structures integrated with the substrate, thereby providing an underfill devoid of voids, wherein the underfill flow guide structures are formed as wires and with an overlay of a hard substance.
Dependencies are inferred from the claim text.