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US 8,409,971 B2Granted
Integrated multicomponent device in a semiconducting die
AssigneeCommissariat a l'Energie Atomique
InventorsJean-Charles Souriau, Francois Baleras
Life of this patent
Estimating the term…
Abstract
An electronic device with integrated discrete components, including a wafer including cavities that can receive the components, an active face of the components being in a same plane as a face of the receiving wafer, and a material for laterally coating the components in the cavities.
Claims18
A method for integrating discrete components in a wafer, the wafer including cavities capable of receiving the components, the method comprising:
- a) making a stack including a support and a double face thermosensitive adhesive layer, the adhesive layer including two faces, each of which is adhesive and thermosensitive, the wafer and the components positioned in the cavities so that their active faces are in a same plane as a front face of the wafer, the front face being assembled with the layer of double face thermosensitive adhesive;
- b) injecting a material for laterally coating the components into the cavities, a hardening temperature of the material being less than a detachment temperature, above which the double face thermosensitive adhesive layer loses its adhesive properties;
- c) hardening the material for laterally coating the components by heating to a temperature that does not suppress adherence properties of the double face thermosensitive adhesive layer;
- and
- d) removing at least one of the support and of one portion of the double face thermosensitive adhesive layer.
2 more elements
An electronic device integrated with discrete components, comprising:
- a wafer including cavities containing the components, an active face of the components being in a same plane as a front face of the wafer;
- a material laterally coating the components in the cavities;
- an adhesive layer in a double face thermosensitive material, the adhesive layer including two faces, each of which is adhesive and thermosensitive, on a side of which are attached the front face of the wafer and the active faces of the components, a support being possibly attached on the other side, a hardening temperature of the material laterally coating the components in the cavities being less than a detachment temperature, above which the double face thermosensitive adhesive layer loses its adhesive properties.
An electronic device integrated with discrete components, comprising:
- a wafer including having cavities containing the components, an active face of the components being in a same plane as a front face of the wafer;
- a material laterally coating the components in the cavities;
- an adhesive layer in a double face thermosensitive material, the adhesive layer including two faces, each of which is adhesive and thermosensitive, on a side of which are attached the front face of the wafer and the active faces of the components, a support being possibly attached on the other side, a hardening temperature of said material laterally coating the components in the cavities being less than a detachment temperature, above which the double face thermosensitive adhesive layer loses its adhesive properties, the thermosensitive adhesive layer being selected from:
- a type including a PET layer covered on each side with a film of thermo-expansible material which loses its adhesive properties when it is heated,
- or a thermal wetting type, separation of the support and of the front face of the wafer being obtained by sliding the layer.
2 more elements
Dependencies are inferred from the claim text.