Method and structure for LED with nano-patterned substrate
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsing-Kuo Hsia, Ching-Hua Chiu
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Abstract
The present disclosure provides one embodiment of a method for fabricating light-emitting diode (LED) devices. The method includes forming a nano-mask layer on a first substrate, wherein the nano-mask layer has a randomly arranged grain pattern; growing a first epitaxy semiconductor layer in the first substrate, forming a nano-composite layer; growing a number of epitaxy semiconductor layers over the nano-composite layer; bonding a second substrate to the epitaxy semiconductor layers from a first side of the epitaxy semiconductor layers; applying a radiation energy to the nano-composite layer; and separating the first substrate from the epitaxy semiconductor layers from a second side of the epitaxy semiconductor layers.
Claims20
A method comprising:
- forming a nano-mask layer on a first substrate, wherein the nano-mask layer has a randomly arranged grain pattern;
- growing a first epitaxy semiconductor layer in the first substrate, forming a nano-composite layer;
- growing a number of epitaxy semiconductor layers over the nano-composite layer;
- bonding a second substrate to the epitaxy semiconductor layers from a first side of the epitaxy semiconductor layers;
- applying a radiation energy to the nano-composite layer;
- and
- separating the first substrate from the epitaxy semiconductor layers from a second side of the epitaxy semiconductor layers.
A method comprising:
- forming a dielectric material layer on a sapphire substrate;
- forming a nano-mask layer on the dielectric material layer, wherein the nano-mask layer includes nano-sized grains randomly distributed on the dielectric material layer;
- performing a first etching process to remove the dielectric material layer uncovered by the nano-mask layer, forming nano-rods each including a dielectric feature from the dielectric material layer and one of the nano-sized grains overlying the dielectric feature;
- growing a first epitaxy semiconductor layer on the sapphire substrate within gaps of the nano-rods, forming a nano-composite layer having the first epitaxy semiconductor layer and the nano-rods embedded in the first epitaxy semiconductor layer;
- growing epitaxy semiconductor layers on the nano-composite layer;
- bonding another substrate to the epitaxy semiconductor layers;
- applying a radiation energy to the nano-composite layer;
- applying a mechanical force to the nano-rods to separate the sapphire substrate from the epitaxy semiconductor layers;
- and
- performing a second etching process to the epitaxy semiconductor layers, resulting in a rough surface of the epitaxy semiconductor layers.
Dependencies are inferred from the claim text.