Methods of embedding thin-film capacitors into semiconductor packages using temporary carrier layers

A method of making a semiconductor package, the method comprising:

• providing a thin-film capacitor, wherein the thin-film capacitor includes a first electrode and a second electrode separated by a dielectric;
• applying a temporary carrier layer to the first electrode after said providing a thin-film capacitor;
• patterning the second electrode;
• providing a printed wiring board (PWB) core and a build-up material, wherein the PWB core includes a first electrically-conductive pad on a first surface, a second electrically-conductive pad on a second surface opposite the first surface, and an electrically-conductive via electrically connecting the first electrically-conductive pad to the second electrically-conductive pad;
• placing the build-up material between the PWB core and the patterned second electrode of the thin-film capacitor;
• laminating the patterned electrode side of the thin-film capacitor to the PWB core by way of the build-up material;
• removing the temporary carrier layer after said laminating;
• and
• patterning the first electrode.