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US 8,409,924 B2Granted
Flexible interconnect pattern on semiconductor package
AssigneeIntel Corporation
InventorsYoshihiro Tomita, David Chau, Gregory M Chrysler, Devendra Natekar
Life of this patent
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Abstract
An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.
Claims12
A method comprising:
- printing a first metal trace on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate;
- mounting a device on the first metal trace, the device receiving power from the substrate when the package is powered;
- and
- routing the first metal trace on the cavity of the heat spreader to a metal bump on the substrate, the metal bump being connected to the power contact.
1 more element
A method comprising:
- forming a power contact in a substrate;
- and
- printing a first metal trace on a die attached to the substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to the power contact in the substrate.
Dependencies are inferred from the claim text.