Integrated circuit packaging system with underfill and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsOh Han Kim, Yong Hee Kang, DaeSik Choi
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate with a projection formed along a perimeter of a first surface of the substrate; mounting an integrated circuit over the first surface; forming a protruding interconnect over the first surface between the projection and the integrated circuit; and forming an underfill between the integrated circuit and the projection with a uniform height, the uniform height of the underfill less than a height of the projection.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a substrate with a projection formed along a perimeter of a first surface of the substrate;
- mounting an integrated circuit over the first surface;
- forming a protruding interconnect over the first surface between the projection and the integrated circuit;
- and
- forming an underfill between the integrated circuit and the projection with a uniform height, the uniform height of the underfill less than a height of the projection.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a substrate with a projection formed along a perimeter of a first surface of the substrate;
- mounting an integrated circuit over the first surface;
- forming a protruding interconnect over the first surface between the projection and the integrated circuit;
- forming an underfill between the integrated circuit and the projection with a uniform height, the uniform height of the underfill less than a height of the projection;
- and
- attaching a device over the integrated circuit by electrically connecting an external connection of the device to the protruding interconnect.
An integrated circuit packaging system comprising:
- a substrate with a projection along a perimeter of a first surface of the substrate;
- an integrated circuit over the first surface of the substrate and attached thereto;
- a protruding interconnect over the first surface between the projection and the integrated circuit;
- and
- an underfill between the integrated circuit and the projection with a uniform height, the uniform height of the underfill less than a height of the projection.
Dependencies are inferred from the claim text.