US 8,409,922 B2 · Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect

Abstract

A semiconductor device has a substrate with a plurality of conductive vias formed through the substrate and first conductive layer formed over the substrate. A first semiconductor die is mounted over the substrate. A second semiconductor die can be mounted over the first semiconductor die. A leadframe interposer has a base plate and a plurality of base leads extending from the base plate. An etch-resistant conductive layer is formed over a surface of the base plate opposite the base leads. The leadframe is mounted to the substrate over the first semiconductor die. An encapsulant is deposited over the substrate and first semiconductor die. The base plate is removed while retaining the etch-resistant conductive layer and portion of the base plate opposite the base leads to electrically isolate the base leads. An interconnect structure is formed over a surface of the substrate opposite the base leads.

Claims31

Dependent claims

A method of making a semiconductor device, comprising:

providing a substrate having a plurality of conductive vias formed through the substrate and first conductive layer formed over the substrate;
mounting a first semiconductor die over the substrate;
providing a leadframe having a base plate and a plurality of base leads extending from the base plate;
forming an etch-resistant conductive layer over a surface of the base plate opposite the base leads;
mounting the leadframe to the substrate over the first semiconductor die;
depositing an encapsulant over the substrate and first semiconductor die;
removing the base plate while retaining the etch-resistant conductive layer and portion of the base plate opposite the base leads to electrically isolate the base leads;
and
forming an interconnect structure over a surface of the substrate opposite the base leads.

6 more elements

Dependencies are inferred from the claim text.

Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect

Life of this patent

Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect

Life of this patent

Abstract

Claims31