Integrated circuit package system including honeycomb molding
AssigneeSTATS ChipPAC, Ltd.
InventorsHeap Hoe Kuan, Hamid Eslampour, DaeSik Choi, Rui Huang, Taeg Ki Lim
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Abstract
A method of manufacture of an integrated circuit package system includes: providing a substrate with a top surface; configuring the top surface to include electrical contacts and an integrated circuit; providing a structure over the substrate with only a honeycomb meshwork of posts contacting the top surface of the substrate; and depositing a material to prevent warpage of the substrate on the top surface of the substrate and over the integrated circuit, the material patterned to have discrete hollow conduits that expose the electrical contacts.
Claims20
A method of manufacture of an integrated circuit package system comprising:
- providing a substrate with a top surface;
- configuring the top surface to include electrical contacts and an integrated circuit;
- providing a structure over the substrate with only a honeycomb meshwork of posts contacting the top surface of the substrate;
- and
- depositing a material to prevent warpage of the substrate on the top surface of the substrate and over the integrated circuit, the material patterned to have discrete hollow conduits exposing the electrical contacts.
A method of manufacture of an integrated circuit package system comprising:
- providing a substrate with a top surface;
- configuring the top surface to include electrical contacts and an integrated circuit;
- providing a structure over the substrate with only a protruding block contacting the top surface of the substrate;
- and
- depositing a material to prevent warpage of the substrate on the top surface of the substrate and over the integrated circuit, the material patterned to have a block conduit exposing the electrical contacts.
Dependencies are inferred from the claim text.