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US 8,409,920 B2Granted
Integrated circuit package system for package stacking and method of manufacture therefor
AssigneeSTATS ChipPAC, Ltd.
InventorsRajendra D. Pendse, Flynn Carson, Il Kwon Shim, Seng Guan Chow
Life of this patent
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Abstract
An integrated circuit package system and method of manufacture therefor includes: forming an area array substrate; mounting surface conductors on the area array substrate; forming a molded package body on the area array substrate and the surface conductors; providing a step in the molded package body; and exposing a surface conductor by the step.
Claims10
A method for manufacturing an integrated circuit package system comprising:
- forming an area array substrate;
- mounting surface conductors on the area array substrate;
- providing a film or material over portions of the surface conductors;
- molding a molded package body with a step surrounding a core section on the area array substrate and the surface conductors such that during the molding step the molded package body does not planarize or come into direct physical contact with the surface conductors, the step for providing access to the surface conductors;
- and
- mounting an area array device supported by the core section protruding above the molded package body.
3 more elements
A method for manufacturing an integrated circuit package system comprising:
- forming an area array substrate having a component side and a system side;
- mounting surface conductors on the area array substrate including pressing a solder ball;
- providing a film or material over portions of the surface conductors;
- molding a molded package body with a step surrounding a core section on the area array substrate and the surface conductors such that during the molding step the molded package body does not planarize or come into direct physical contact with the surface conductors, the step providing access to the surface conductors and reducing a step height from the core section for forming a region surrounding the core section being parallel to the area array substrate;
- and
- mounting an area array device supported by the core section protruding above the molded package body.
3 more elements
Dependencies are inferred from the claim text.