Semiconductor device and method of forming pre-molded substrate to reduce warpage during die mounting

A method of making a semiconductor device, comprising:

• providing a substrate including a conductive layer formed over the substrate;
• depositing a first encapsulant over the substrate outside a die attach area of the substrate, the die attach area being devoid of the first encapsulant;
• disposing a first semiconductor die over the substrate within the die attach area after depositing the first encapsulant, the first semiconductor die electrically connected to the conductive layer formed over the substrate;
• depositing a second encapsulant over the first semiconductor die and first encapsulant;
• and
• mounting a second semiconductor die to the first semiconductor die within the die attach area prior to depositing the second encapsulant.

A method of making a semiconductor device, comprising:

• providing a substrate including a conductive layer formed over the substrate;
• depositing a first encapsulant over the substrate outside a die attach area of the substrate, the die attach area being devoid of the first encapsulant;
• disposing a first semiconductor die over the substrate within the die attach area after depositing the first encapsulant, the first semiconductor die electrically connected to the conductive layer formed over the substrate, wherein the first encapsulant has a thickness equal to or less than a height of the first semiconductor die;
• and
• depositing a second encapsulant over the first semiconductor die and first encapsulant.

A method of making a semiconductor device, comprising:

• providing a substrate including a pre-molded encapsulant formed over a surface of the substrate outside a die attach area of the substrate, the die attach area being devoid of the pre-molded encapsulant;
• disposing a first semiconductor die over the substrate within the die attach area, the first semiconductor die electrically connected to the substrate;
• depositing a second encapsulant over the first semiconductor die and pre-molded encapsulant;
• and
• mounting a second semiconductor die to the first semiconductor die within the die attach area prior to depositing the second encapsulant.

A method of making a semiconductor device, comprising:

• providing a substrate including a pre-molded encapsulant formed over a surface of the substrate outside a die attach area of the substrate, the die attach area being devoid of the pre-molded encapsulant;
• mounting a first semiconductor die to the substrate within the die attach area;
• depositing a second encapsulant over the first semiconductor die and pre-molded encapsulant;
• and
• depositing the second encapsulant using a mold underfill process.

A method of making a semiconductor device, comprising:

• providing a substrate including a conductive layer formed over the substrate;
• depositing a first encapsulant over the substrate outside a die attach area of the substrate;
• disposing a first semiconductor die over the substrate and within the die attach area after depositing the first encapsulant, the first semiconductor die electrically connected to the conductive layer formed over the substrate;
• and
• providing a channel connecting adjacent die attach areas, wherein the channel is devoid of the first encapsulant.