Integrated circuit packaging system with an interposer substrate and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsIn Sang Yoon, HeeJo Chi, HanGil Shin
Life of this patent
Estimating the term…
Abstract
A method of manufacturing of an integrated circuit packaging system includes: providing a base substrate; mounting a first die over the base substrate; mounting a second die over the first die; attaching an interposer substrate over the first die with an attachment adhesive therebetween, the interposer substrate having a central cavity and the second die within the central cavity; attaching a lateral interconnect to a second active side away from the first die of the second die and to the interposer substrate; and encapsulating the first die and the second die.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a base substrate;
- mounting a first die over the base substrate;
- mounting a middle die on an active side of the first die;
- mounting a second die on a middle active side of the middle die on the active side of the first die;
- attaching base interconnects to the base substrate;
- attaching an interposer substrate over the first die with an attachment adhesive therebetween, the interposer substrate having a central cavity with the second die within the central cavity and the base interconnects connected to the interposer substrate and the base substrate;
- attaching a lateral interconnect to a second active side of the second die away from the first die and to the interposer substrate;
- and
- encapsulating the base interconnects, the first die, and the second die in a single molding process.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a base substrate;
- mounting a first die over the base substrate;
- mounting a middle die on an active side of the first die;
- mounting a second die on a middle active side of the middle die on the active side of the first die;
- attaching base interconnects, to the base substrate, in multiple rows around the first die;
- attaching an interposer substrate over the first die with an attachment adhesive therebetween having a central cavity supported by the base interconnects, the base interconnects on the base substrate and the second die within the central cavity;
- attaching a lateral interconnect to a second active side of the second die away from the first die and to the interposer substrate;
- and
- encapsulating the base interconnects, the first die, and the second die in a single molding process.
An integrated circuit packaging system comprising:
- a base substrate;
- a first die mounted over the base substrate;
- an attachment adhesive over the first die;
- a middle die on an active side of the first die;
- base interconnects attached on the base substrate around the first die;
- an interposer substrate over the attachment adhesive and coupled to the base interconnects, the interposer substrate having a central cavity;
- a second die mounted on a middle active side of the middle die on the active side of the first die and in the central cavity;
- a lateral interconnect attached to a second active side of the second die away from the first die and to the interposer substrate;
- and
- a single encapsulation formed on the base interconnects, the first die, and the second die.
Dependencies are inferred from the claim text.