US 8,409,899 B2 · Delamination and crack resistant image sensor structures and methods

Abstract

A plurality of image sensor structures and a plurality of methods for fabricating the plurality of image sensor structures provide for inhibited cracking and delamination of a lens capping layer with respect to a planarizing layer within the plurality of image sensor structures. Particular image sensor structures and related methods include at least one dummy lens layer of different dimensions than active lens layer located over a circuitry portion of a substrate within the particular image sensor structures. Additional particular image sensor structures include at least one of an aperture within the planarizing layer and a sloped endwall of the planarizing layer located over a circuitry portion within the particular image sensor structures.

Claims11

Dependent claims

A method for fabricating an image sensor structure comprising:

providing a substrate including a photosensitive portion and a circuitry portion;
forming a dielectric isolated metallization stack located upon the substrate;
forming a planarizing layer over the dielectric isolated metallization stack;
forming a plurality of active lens layers located over the planarizing layer and registered with a plurality of photosensitive regions within the photosensitive portion, and forming at least one dummy lens layer of different dimensions at least in part over the planarizing layer and over the circuitry portion;
and
forming a lens capping layer passivating exposed portions of the plurality of active lens layers, the at least one dummy lens layer and the planarizing layer.

3 more elements

Dependencies are inferred from the claim text.

Delamination and crack resistant image sensor structures and methods

Life of this patent

Delamination and crack resistant image sensor structures and methods

Life of this patent

Abstract

Claims11