Photosensitive resin composition, dry film, and processed product made using the same

A photosensitive resin composition comprising:

• (A) (meth)acrylate compound having the following general formula (1′);
• (B) polyimide precursor;
• and
• (C) photopolymerization initiator,
• wherein (B) polyimide precursor is a polyamic acid produced from a carboxylic acid dianhydride and a diamine composition including a diamine having the following general formula (2) and an aromatic diamine, a mole ratio of the diamine having the following general formula (2) to the aromatic diamine being 0.05 to 4.9,
• where R1 denotes a hydrogen atom or methyl group;
• R2 denotes a monovalent organic group comprising an alkyl group, a carboxy-terminated organic group formed by ring-opening addition reaction of acid anhydride with methylhydroxyl group, a vinyl group, and a glycidyl group;
• n and m each denote an integer of 1 to 5;
• p denotes an integer of 0 to 6;
• q and r each denote an integer of 0 to 4;
• and s denotes an integer of 0 to 6, wherein the sum of p, q, r and s is 6, and the sum of p and s ranges from 3 to 6,
• H2N—(R3O)n—R4—NH2 (2)
• where R3 and R4 each denote an aliphatic hydrocarbon group having 1-6 carbon atoms, and n denotes an integer of 1 to 30.