Epoxy carboxyl resin mixture hole blocking layer photoconductors

A photoconductor consisting of a substrate;

• an undercoat layer thereover consisting of a mixture consisting of a metal oxide, and a crosslinked mixture of a crosslinked epoxy resin and a carboxyl resin;
• a photogenerating layer;
• and a charge transport layer, wherein said resin mixture is present in an amount of from about 20 to about 60 weight percent, wherein the total of said components in said undercoat layer is about 100 percent, wherein said epoxy resin is present in said resin mixture in an amount of from about 10 to about 40 weight percent, and said carboxyl resin is present in said resin mixture in an amount of from about 90 to about 60 weight percent, and wherein the total resin mixture solids thereof is about 100 percent;
• and wherein said epoxy resin possesses a weight average molecular weight of from about 250 to about 12,000, and said carboxyl resin possesses a weight average molecular weight of from about 1,500 to about 20,000.

A rigid or flexible photoconductor consisting of in sequence a supporting substrate;

• a hole blocking layer of a titanium oxide, and a mixture consisting of an epoxy resin and a carboxyl resin:
• a photogenerating layer, and a charge transport layer;
• and wherein the mixture is crosslinked at a percentage of from about 60 to about 95 percent, and which crosslinking is accomplished with a catalyst, and wherein said epoxy resin is a diglycidyl ether of bisphenol A epoxy resin, a diglycidyl ether of bisphenol F epoxy resin, and mixtures thereof;
• wherein said catalyst is an acid selected from a group consisting of oxalic acid, maleic acid, carboxylic acid, ascorbic acid, malonic acid, succinic acid, tartaric acid, citric acid, p-toluenesulfonic acid, methanesulfonic acid, and mixtures thereof, present in an amount of from about 0.1 to about 5 weight percent based on the total weight of said resin mixture;
• or a base selected from a group consisting of triethyl amine, diethylenetriamine, triethylenetetramine, isphoronediamine, bis-p-aminocyclo hexylmethane, 1,2-diaminocyclohexane, diaminodiphenylmethane, and mixtures thereof, present in an amount of from about 0.1 to about 10 weight percent based on the total weight of said resin mixture, and wherein said carboxyl resin is an acrylic carboxyl resin and wherein said epoxy resin possesses a weight average molecular weight of from about 60 to about 30,000, and said carboxyl resin possesses a weight average molecular weight of from about 1,500 to about 20,000.