Method of manufacturing evaporation donor substrate and method of manufacturing light-emitting device

A method of manufacturing a light-emitting device, comprising the steps of:

• forming a light absorption layer over one surface of a first substrate;
• forming a material layer on the light absorption layer;
• providing a second substrate over the first substrate, wherein a reflective layer having an opening is provided over the second substrate, and wherein the second substrate is provided so that the material layer and the reflective layer face each other;
• irradiating the first substrate with laser light which is first light from the second substrate side, so as to sublime a part of the material layer which is irradiated with the laser light onto a portion of the second substrate where the reflective layer is not formed, through the opening of the reflective layer;
• removing the second substrate;
• providing a third substrate over the first substrate, wherein the third substrate is provided so that the one surface of the first substrate and a deposition target surface of the third substrate face each other;
• and
• irradiating the first substrate with lamp light which is second light from a surface over which the light absorption layer and the material layer are not formed, so as to evaporate a remained part of the material layer over the first substrate onto the deposition target surface of the third substrate.

A method of manufacturing an evaporation donor substrate, comprising the steps of:

• forming a light absorption layer over one surface of a first substrate;
• forming a material layer on the light absorption layer;
• providing a second substrate over the first substrate, the second substrate including a reflective layer and a spacer over the reflective layer, wherein the reflective layer has an opening and the spacer is not overlapped with the opening over the second substrate, and wherein the second substrate is provided so that the spacer and the material layer face each other;
• and
• irradiating the first substrate with laser light from the second substrate side, so as to sublime a part of the material layer which is irradiated with the laser light through the opening of the reflective layer.

A method of manufacturing a light-emitting device, comprising the steps of:

• forming a light absorption layer over one surface of a first substrate;
• forming a material layer on the light absorption layer;
• providing a second substrate over the first substrate, the second substrate including a reflective layer and a spacer over the reflective layer, wherein the reflective layer has an opening and the spacer is not overlapped with the opening over the second substrate, and wherein the second substrate is provided so that the spacer and the material layer face each other;
• irradiating the first substrate with laser light which is first light from the second substrate side, so as to sublime a part of the material layer which is irradiated with the laser light through the opening of the reflective layer;
• removing the second substrate;
• providing a third substrate over the first substrate, wherein the third substrate is provided so that the one surface of the first substrate and a deposition target surface of the third substrate face each other;
• and
• irradiating the first substrate with lamp light which is second light from a surface over which the light absorption layer and the material layer are not formed, so as to evaporate a remained part of the material layer over the first substrate onto the deposition target surface of the third substrate.

A method of manufacturing an evaporation donor substrate, comprising the steps of:

• forming a material layer on a light absorption layer, wherein the light absorption layer is formed over a first substrate;
• disposing a second substrate having a reflective layer and a spacer in such a manner that the spacer faces and is in contact with the material layer, wherein the reflective layer is not overlapped with the spacer;
• and
• irradiating the first substrate with laser light from a side of the second substrate through an opening of the reflective layer so as to sublime a part of the material layer which is irradiated with the laser light though the opening of the reflective layer.

A method of manufacturing a light-emitting device, comprising the steps of:

• forming a material layer on a light absorption layer wherein the light absorption layer is formed over a first substrate;
• disposing a second substrate having a reflective layer and a spacer in such a manner that the spacer faces and is in contact with the material layer, wherein the reflective layer includes an opening;
• irradiating the first substrate with laser light which is first light from a side of the second substrate through the opening of the reflective layer so as to sublime a part of the material layer which is irradiated with the laser light though the opening of the reflective layer;
• removing the second substrate;
• disposing a third substrate having a deposition target surface in such a manner that the deposition target surface faces another part of the material layer remained over the first substrate;
• and
• irradiating the first substrate with lamp light which is second light from a side of the first substrate, so as to evaporate the another part of the material layer remained over the first substrate onto the deposition target surface of the third substrate.